TE2412 Search Results

ldpak

Abstract: PRSS0004AB PRSS0004AE
Contextual Info: Unit:mm Reel type A A 330 N 100 W1 25.5 W2 29.5 Dimensions mm A0 B0 K0 10.8 13.9 4.9 F 11.5 D1 2 Maximum storage No. Transistor/Reel 1000 24-mm width emboss taping Taping code Package name TE2412G-TO220S TO-220S TE2412-31P, 32P LDPAK(S)-(1) TE2416-13P

TE32D

Abstract: EIA and EIAJ tape standards TE3212 EIA and EIAJ standards RC-1009B TA7745
Contextual Info: 6. PACKING INFORMATION To deliver flat IC packages, three package method are available: the same stick packages as the ordinary DIP type, taping, and embossed taping. 6-1 Stick Specifications for Flat Packages • Shape and dimensions Example: FLP type Fig. 6-1

SOL16-P

Abstract: TE161 L86D SOL14-P-150
Contextual Info: 7-2 Package SOP 14PIN {1 50m il BO D Y} O UTLIN E DRAW IN G SOL14-P-150 76 U nit in mm SOP 20PIN (BOOmil BO D Y) O UTLIN E DRAW IN G (50L20-P-300) 77 U nit in mm SOP 14-PIN (200m il BO D Y) O UTLIN E DRAW IN G (SOP14-P-300) U nit in mm I 1 0.8MAX •-o ?

TSSOP20-P-0044-0

Abstract: TSS0P14 TSSOP16-P-0044-0 SOP14-P TSSOP-20P TE16 SOP-16P TSSOP20-P-0044 gbc 20 u TSS0P16-P-0044-0
Contextual Info: TOSHIBA [9 ] [9 ] Ü iÍR rS Iis J f^ Ü 9.1 TC74VHCVV - X D &*y*T ~ V(SOP. TSSOP | npCö* * ti •?tiV y>¿f ~ tf>7if fflÄ £tlTl'S 1"o fetz iss TSSOPíioi'T ¿:&U£T0 Í5IJ) TC74VHC244 F (EL) 1 ^ - m n

TE1204

Abstract: ta7291 SSOP10 Package EIA481A RC-1009B
Contextual Info: [ 4 ] Embossed Tape Specifications for Flat-Package Bipolar ICs [ 4 ] Embossed Tape Specifications for Flat-Package Bipolar ICs 1. Scope Specifications for embossed-tape packing for flat-package bipolar ICs and related issues such as ordering are usually in accordance with the relevant JEITA and JEDEC standards (RC-1009B and

Contextual Info: T6B70BFG TOSHIBA CMOS Digital Integrated Circuit Silicon Monolithic T6B70BFG Interface IC for Hot Water Dispensers The T6B70BFG is designed to be used mainly as an interface IC for communication between hot water dispensers and the corresponding controller unit, and comes equipped with a two

SSOP20-P-225A TAPING

Abstract: L16P
Contextual Info: 7-3 Shipping Style and Ordering M ethods TC74LCX / LVQ / LVX products can be shipped in tubes or on tape and reel. However, SSOP and TSSOP products are shipped on Tape & Reel. P a ck a g e S u ffix S h ip p in g S tyle NONE T ub e ELP Em b o ssed T a p e

TOSHIBA el suffix

Abstract: SOL16-P TOSHIBA 0 el suffix
Contextual Info: TOSHIBA 11. [11] Shipping Style Shipping Style 1 Shipping Style and Ordering Methods. TC74VHC products can be shipped in tubes or on tape and reel. However, SSOP, TSSOP products are shipped on Tape & Reel in 2000 pcs only. TC74VHC244FN (ELP) Shipping Style

SG-8002CE

Abstract: EV3201 Q22MA406 sg smd code TE-080 5100SA RTC7301SF Q33615xxxxxxx00 MG-5100SA Q25FS335
Contextual Info: Applications guide  COMPARISON TABLE FOR MODEL AND PRODUCT NUMBER When ordering ,please specify Product Number. For Product Number before contacting us, please confirm specifications for “xxxxx” and standard packing specifications page 6  CRYSTAL UNIT

9612h

Abstract: TSS0P16-P-0044-0 TC74 TC74AC TC74AC00 TC74AC00F TC74AC00FT TC74AC00P TC74AC244 sop14-p-300
Contextual Info: £liK «E AJ m Dq PO s> 4Q w ìi AJ #dl r “Ñ* 6 nife rifo E 5 n r •n Ifc Ph S < i K* m m E o Dq V H m U i—i 02 o u o o u < t> u H o o O c t> Q H ip ■&J AJ Ü AJ Ifc flK ng B? G P o o u < rv u Eh fe O O U < u Eh A ih m TOSHIBA [13] 3InnÜ7JÑ t 1 3 .2

Contextual Info: • PACKING SPECIFICATIONS 1. Cylinder C ylin d e r p ro du cts are pa cked in vinyl ba gs in lots of 250 to 1,000 pcs. From 5 to 20 ba gs are then placed in in ner bo xes to m ake a lot. Inner bo xe s are then placed in ca rto n s fo r shipm ent. 2. SIP SIP p ro du cts are pa cked in in n e r b o xe s in lots of 100 pcs. T h e y are the n placed on to the co n d u ctive foa m and placed for

smd transistor marking wm4

Abstract: STM CL-70 R8025 real time clock SMD MARKING CODE WM4 E8564 fa-248 SG-636PTF ww1 transistor smd smd transistor WW1 Marking code SCW
Contextual Info: THE CRYSTALMASTER ENERGY SAVING EPSON EPSON offers effective savings to its customers through a wide range of electronic devices, such as semiconductors, liquid crystal display LCD modules, and crystal devices. These savings are achieved through a sophisticated melding of three different efficiency technologies.

TC74HC00F

Abstract: T6B70BF RC-1009B T6B70BFG TE1612 sine wave generator
Contextual Info: T6B70BFG TOSHIBA CMOS Digital Integrated Circuit Silicon Monolithic T6B70BFG Interface IC for Hot Water Dispensers The T6B70BFG is designed to be used mainly as an interface IC for communication between hot water dispensers and the corresponding controller unit, and comes equipped with a two

Contextual Info: T6B70BFG TOSHIBA CMOS Digital Integrated Circuit Silicon Monolithic T6B70BFG Interface IC for Hot Water Dispensers The T6B70BFG is designed to be used mainly as an interface IC for communication between hot water dispensers and the corresponding controller unit, and comes equipped with a two

SG-8002JF

Abstract: Q33615xxxxxxx00 2101CA peci
Contextual Info: Applications guide COMPARISON TABLE FOR MODEL AND PRODUCT NUMBER When ordering ,please specify Product Number. For Product Number before contacting us, please confirm specifications for "xxxxx" and standard packing specifications page 3 CRYSTAL UNIT Low and medium-frequency

TE0804L

Abstract: 2150C
Contextual Info: Crystal Oscillator Model SG-3030/3032/3040JC SG-3030JF SG-3030/3040LC SG-350 Series SG-550 Series SG-310 Series SG-645 Series SG-710 Series SG-636 Series SG-615 Series SG-8002LA SG-8002LB SG-8002CE SG-8002JF SG-8002CA SG-8002JC SG-8002JA SG-9001CA SG-9001JC

SG-8002CE

Abstract: 2150C Q33M11SA Q22FA238 ultrasonic piezo buzzer RX-8564CF Q24FA23H ic cd 4553 VG4010 Q25FS335
Contextual Info: Applications guide COMPARISON TABLE FOR MODEL AND PRODUCT NUMBER When ordering ,please specify Product Number. For Product Number before contacting us, please confirm specifications for "xxxxx" and standard packing specifications page 3 CRYSTAL UNIT Low and medium-frequency

TE32D

Abstract: TOSHIBA el SSOP20-P-225A SSOP20-P-225A EL TD62003 TE-32 TE16081
Contextual Info: [6 ] PACKING IN FO RM ATION S 1. Tape Specification for Bipolar-Type Flat Package ICs [6 ] PACKING INFORMATIONS 1. Tape Specification for Bipolar-Type Flat Package ICs 1 A p p lic a tio n ran g e This sp e cificatio n covers ta p e p ack a g in g fo r T o shiba b ip o lar-typ e flat-pack ICs. Item s such

RC-1009B

Abstract: EIA431A IC A 244 TE1204 IC504 1009b TE12041208 TE3212
Contextual Info: [4] バイポーラ形フラットパッケージ IC のエンボステーピング仕様 [ 4 ] バイポーラ形フラットパッケージ IC エンボステーピング 仕様 1. 適用範囲 バイポーラ形 IC フラットパッケージ品のエンボステーピング包装仕様および関連事項については原則

TB62207

Abstract: TB6571FG TA2092N TA8435H TB62207B TA7291P QON36-P-0606-0 TB62201AF ta7259p TB6575FNG
Contextual Info: モータ用IC ● 当社は品質､信頼性の向上に努めておりますが､一般に半導体製品は誤作動した り故障することがあります｡当社半導体製品をご使用いただく場合は､半導体製 品の誤作動や故障により､生命･身体･財産が侵害されることのないように､購入

TE1612

Abstract: SSOP24 TSSOP14 TSSOP48
Contextual Info: [ 10 ] 出荷梱包形態 [ 10 ] 出荷梱包形態 1. 名称と分類 TC74VCX/LCX/LVX シリーズの名称は以下に示すように決められています。 TC74LCX xxx F EL • 梱包形態 • ファミリー名 74VCX = VCX シリーズ IC 74LCX = LCX シリーズ IC

PRSP0020DA-A

Abstract: PRSP0036GA-A FP-100T 52PTG TE2416 PLQP0080KD-A PTSA0032KB-A TVBG0216KA-A BP-114 TE2416-24P
Contextual Info: Standard Orientation of Package The pin 1 is located in the hatching portion. Reel off direction The pin 1 may also be located in the following portion for reverse bent packages and some QFPs. Reel off direction ReelType TYPE A TYPE B A 254 330 N 100 100

SG8002CE

Abstract: TE0804L 555 SMD
Contextual Info: Applications guide  STANDARD PACKING SPECIFICATIONS The last 2 digit of Product Number “00” means standard packing specifications. The other packing specifications are custom,therefore, the last 2 digits of Product Number is changed. Please contact us for in guiries. For SMD products, standard

TC74HC00F

Abstract: T6B70BFG K738 T6B70BF RC-1009B TE1612
Contextual Info: T6B70BFG 東芝 CMOS 形デジタル集積回路 シリコン モノリシック T6B70BFG 給湯器用インタフェース IC T6B70BFG は主に給湯器用として4 ビット D/A コンバータ 2 チ ャネル、擬似正弦生成回路、外部アナログ信号検出回路を内蔵し、