D1437
Abstract: QFJ044-P-0650 44-PIN LH532048 561 A7
Text: CMOS 2M 128K x 16 Mask-Programmable ROM • 131,072 words × 16 bit organization • Access time: 100 ns (MAX.) PIN CONNECTIONS 40-PIN DIP 40-PIN SOP TOP VIEW • Static operation NC 1 40 VCC CE 2 39 NC • TTL compatible I/O D15 3 38 A16 4 • Three-state outputs
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LH532048
40-PIN
40-pin,
600-mil
44QFJ-2
44-pin,
650-mil
D1437
QFJ044-P-0650
44-PIN
LH532048
561 A7
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TRC 561 a3 diagram
Abstract: S71214-00-000 555H SST34HF1681 S71214
Text: 16 Mbit Concurrent SuperFlash + 8 Mbit SRAM ComboMemory SST34HF1681 SST34HF16818 Mb Flash x16 Concurrent SuperFlash ComboMemory Advance Specifications FEATURES: • Flash Organization: 1M x16 • Dual-Bank Architecture for Concurrent Read/Write Operation
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SST34HF1681
SST34HF16818
56ba-LFBGA-L1P-8x10-450mic-ILL
MO-210,
56-BALL
S71214-00-000
TRC 561 a3 diagram
555H
SST34HF1681
S71214
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S71214-00-000
Abstract: S71214 s7-1214 555H SST34HF1681
Text: 16 Mbit Concurrent SuperFlash + 8 Mbit SRAM ComboMemory SST34HF1681 SST34HF168116Mb CSF x16 + 8Mb SRAM (x16) MCP ComboMemory Preliminary Specifications FEATURES: • Flash Organization: 1M x16 • Dual-Bank Architecture for Concurrent Read/Write Operation
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SST34HF1681
SST34HF168116Mb
MO-210,
56-BALL
S71214-00-000
S71214
s7-1214
555H
SST34HF1681
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Untitled
Abstract: No abstract text available
Text: NT1GT64UH8D0FN / NT2GT64U8HD0BN NT1GT64UH8D0FS / NT2GT64U8HD0BS 1GB: 128M x 64 / 2GB: 256M x 64 PC2-4200 / PC2-5300 / PC2-6400 Unbuffered DDR2 SO-DIMM Based on DDR2-533/667/800 64Mx16 1GB /128Mx8 (2GB) SDRAM D-Die Features • Performance: PC2-4200 PC2-5300
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NT1GT64UH8D0FN
NT2GT64U8HD0BN
NT1GT64UH8D0FS
NT2GT64U8HD0BS
PC2-4200
PC2-5300
PC2-6400
DDR2-533/667/800
64Mx16
/128Mx8
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MAY94
Abstract: RASOA11
Text: HY5116100 Series «HYUNDAI 16M X 1-bit CMOS DRAM DESCRIPTION The HY5116100 is the new generation and fast dynamic RAM organized 16,777,216 x 1-bit. The HY5116100 utilizes Hyundai's CMOS silicon gate process technology as well as advanced circuit techniques to provide wide operating
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HY5116100
1AD01-10-MAY94
HY5116100JC
HY5116100UC
HY5116100TC
HY5116100LTC
MAY94
RASOA11
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334-B
Abstract: HN62314BP
Text: HN62314B Series HN62334B Series 4M 512K x 8-bit Mask ROM • DESCRIPTION The Hitachi HN62314B/HN62334B Series is a 4-Megabit CMOS Mask Programmable Read Only Memory organized as 524,288 x 8bit. The low power consumption of this device makes it ideal for
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HN62314B
HN62334B
HN62314B/HN62334B
32-pin
32-lead
ns/170
ns/200
334-B
HN62314BP
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Untitled
Abstract: No abstract text available
Text: HY51V17400B Series •HYUNDAI 4M X 4-bit CMOS DRAM PRELIMINARY DESCRIPTION The HY51V17400B is the new generation and fast dynamic RAM organized 4,194,304 x 4-bit. The HY 51V17400B utilizes Hyundai’s CMOS silicon gate process technology as well as advanced circuit techniques to provide wide
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HY51V17400B
51V17400B
HY51V17400Bto
1AD48-00-MAY95
HY51V17400BJ
HY51V17400BSU
HY51V17400BT
HY51V17400SLT
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HYM53641
Abstract: No abstract text available
Text: •HYUNDAI SEMICONDUCTOR HYM 536410 B S e rie s 4M X 36-bit CMOS ORAM MODULE PRELIMINARY DESCRIPTION The HYM53641 OB is a 4M x 36-blt Fast page mode CMOS DRAM module consisting of nine HY5117400 in 24/28 pin SOJ on a 72 pin glass-epoxy printed circuit board. 0.22^F decoupling capacitor is mounted for each DRAM.
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36-bit
HYM53641
36-blt
HY5117400
HYM53641OBM/BLM
HYM53641OBMG/BLMG
1CE07-00-MAY93
HYM536410B
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Untitled
Abstract: No abstract text available
Text: •HYUNDAI H Y 5 1 1 6 1 0 0 S e r ie s 16Mx1-btt C M O S D R A M DESCRIPTION "The HY5116100 is the new generation and fast dynamic RAM organized 16,777,216x 1-bit. The HY5116100 utilizes Hyundai's CMOS silicon gate process technology as well as advanced circuit techniques to provide wide operating
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OCR Scan
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16Mx1-btt
HY5116100
1AD01-10-MAY94
HY5116100JC
HY5116100UC
HY5116100TC
HY5116100LTC
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Untitled
Abstract: No abstract text available
Text: O K I Semiconductor MSM5 1V4800/SL 524,288-Word x 8-Bit DYNAMIC RAM : FAST PAGE MODE TYPE DESCRIPTIO N The MSM51V4800/SL is a new generation dynamic RAM organized as 524,288-word x 8-bit. The technology used to fabricate the MSM51V4800/SL is OKI's CMOS silicon gate process
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1V4800
288-Word
MSM51V4800/SL
cycles/16ms,
cycles/128ms
MSM51V4800/SL
D01A250
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A109D
Abstract: max3843 lcd hyundai WWD 3P hyundai hy 555
Text: HY51V17400B Series •HYUNDAI 4M X 4-bit CMOS DRAM PRELIMINARY DESCRIPTION The HY51V17400B is the new generation and fast dynamic RAM organized 4,194,304 x 4-bit. The HY 51V17400B utilizes H yundai's CM OS silicon gate process technology as well as advanced circuit techniques to provide wide
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HY51V17400B
51V17400B
0260X68040)
157BSC
1AD48-00-MAY95
HY51V17400BJ
HY51V17400BSD
A109D
max3843
lcd hyundai
WWD 3P
hyundai hy 555
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Z0301
Abstract: No abstract text available
Text: •HYUNDAI HYM53641 OB Series SEMICONDUCTOR 4M X 36-bit CMOS DRAM MODULE PRELIMINARY DESCRIPTION The HYM536410B is a 4M x 36-bit Fast page mode CMOS DRAM module consisting of nine HY5117400 in 24/28 pin SOJ on a 72 pin glass-epoxy printed circuit board. Q.22pF decoupling capacitor is mounted for each DRAM.
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HYM53641
36-bit
HYM536410B
HY5117400
HYM536410BM/BLM
HYM536410BMG/BLMG
C55-BEFORE-KÃ
1CE07-00-MAY93
Z0301
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Untitled
Abstract: No abstract text available
Text: NMC2147H National SSA Semiconductor NMC2147H 4096 x 1-Bit Static RAM G eneral D e scription Features The NMC2147H is a 4096-word by 1-bit static random ac cess memory fabricated using N-channel silicon-gate tech nology. All internal circuits are fully static and therefore re
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NMC2147H
NMC2147H
4096-word
TL/D/5257-7
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Untitled
Abstract: No abstract text available
Text: j SAMSUNG ELECTRONICS INC 42E D • TTbMlME 00104SG 4 KMM591000N DRAM MODULES 1 M x 9 DRAM S IM M Memory Module FEATURES GENERAL DESCRIPTION ’" ' The Samsung KMM591000N is a 1M bit x 9 Dynamic RAM high density memory module. The Samsung KMM591000N consist of. two 4M b it DRAMs
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00104SG
KMM591000N
KMM591000N
KM44C1000J-1M
20-pin
KM41C1000AJ-1M
20-pln
30-pin
150ns
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Untitled
Abstract: No abstract text available
Text: November 1993 Edition 2.0 FUJITSU DATA SHEET : MB82009-20/-25 CMOS 1M-BIT HIGH SPEED SRAM 131,072-WORD X 9-BIT HIGH SPEED STATIC RANDOM ACCESS MEMORY The Fujitsu MB82009 is 131,072-word x 9-bit high speed static random access m em ory fabricated w ith CMOS technology.
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MB82009-20/-25
072-WORD
MB82009
36-LEAD
LCC-36P-M01)
36051S-2C
374T75b
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SO DIMM DRAM 72Pin Connector Pinout
Abstract: No abstract text available
Text: 72-PIN SO-DIMMS STI322004D2-60VG 2M X 32 Bits DRAM SO-DIMM EDO Memory Module FEATURES • GENERAL DESCRIPTION Performance range: tRAC 60ns tCAC 17ns tRC 104ns The Simple Technology STI322004D2-60VG is a 2M x 32 bits Dynamic RAM high density memory module The Simple
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STI322004D2-60VG
72-PIN
104ns
STI322004D2-60VG
44-pin
400-mil
SO DIMM DRAM 72Pin Connector Pinout
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Untitled
Abstract: No abstract text available
Text: KMM366F400BK KMM366F41OBK DRAM MODULE K M M 366F400B K & KM M 366F410BK ED O Mode w ithout buffer 4Mx64 DRAM DIMM based on 4Mx4, 4K & 2K Refresh, 3.3V GENERAL DESCRIPTION FEATURES The Samsung KMM366F40 1 0BK is a 4M bit x 64 Dynamic RAM high density memory module. The
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KMM366F400BK
KMM366F41OBK
366F400B
366F410BK
4Mx64
KMM366F40
300mil
168-pin
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Untitled
Abstract: No abstract text available
Text: H Y 5 1 V 16 4 1 O A S e r ie s “HYUNDAI 4M X 4-bit CMOS DRAM with WPB PRELIMINARY DESCRIPTION The HY51V16410A is the new generation and fast dynamic RAM organized 4,194,304 x 4-bit. The HY51V16410A utilizes Hyundai’s CMOS silicon gate process technology as well as advanced circuit techniques to provide wide
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HY51V16410A
HY51V1641
D32-00-MAY94
4b75Dflfl
HY51V16410AJC
HY51V16410ASLJC
HY51V16410ATC
HY51V16410ASLTC
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414256
Abstract: D414256 NEC 20PIN DIP
Text: NEC /¿P D 414256 2 6 2 ,1 4 4 X 4 -B IT D YN A M IC NMOS RAM NEC Electronics Inc. P R E L IM IN A R Y INFORMATION Description Pin Configurations The //PD414256 is a 262,144-word by 4-bit dynamic N-channel MOS random access memory RAM de signed to operate from a single +5 V power supply. The
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20-Pin
uPD414256
144-word
/UPD414256
414256
D414256
NEC 20PIN DIP
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gi115
Abstract: No abstract text available
Text: -«YUNDWI — • H Y M 5 V 6 4 4 1 4 B K - S e r ie s Unbuffered 4Mx64 bit EDO DRAM MODULE based on 4Mx4 DRAM, 3.3V, 2K-Refresh GENERAL DESCRIPTION The HYM 5V64414B K-Series is a 4Mx64-bit Extended Data Out mode CMOS DRAM module consisting of sixteen HY51V17404B in 24/26 pin SOJ or TSOP-II and one 2048 bit EEPROM on a 168 pin glass-epoxy
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4Mx64
5V64414B
4Mx64-bit
HY51V17404B
HYM5V64414BKG/BTKG
168-Pin
256OOK
64414B
j4-/-noc44
gi115
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Untitled
Abstract: No abstract text available
Text: July 1993 Edition 1.0 FUJITSU DATA SHEET MB85379A-60/-70/-80 CMOS 2M x 40 Fast Page Mode DRAM Module CMOS 2,097,152 x 40 Bit Fast Page Mode DRAM Module The Fujitsu MB85379A is a fully decoded CMOS Dynamic Random Access Memory DRAM Module consisting of twenty MB814400A devices.
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MB85379A-60/-70/-80
MB85379A
MB814400A
40-bit
72-pad
MSS-72P-P17
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Untitled
Abstract: No abstract text available
Text: -HYUNDAI HYM572A400A N-Series 4M X 72-bit CMOS DRAM MODULE DESCRIPTION The HYM572A400A is a 4M x 72-bit Fast page mode CMOS DRAM module consisting of eighteen HY5116400A in 24/28 pin TSOP-ll and two 16-bit BiCMOS line drivers in TSSOP on a t68 pin glass-epoxy printed circuit board.
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HYM572A400A
72-bit
HY5116400A
16-bit
HYM572A400ATNG/ASLTNG
121mW
220mW
A0-A11
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Untitled
Abstract: No abstract text available
Text: O K I Semiconductor M S M 5 6 V 1 6 4 0 0 2-Bank x 2,097,152-Word x 4-Bit SYNCHRONOUS DYNAMIC RAM DESCRIPTIO N The MSM56V16400 is a 2-bank x 2,097,152-word x 4-bit synchronous dynamic RAM, fabricated in OKI's CMOS silicon gate process technology. The device operates at 3.3 V. The inputs and
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152-Word
MSM56V16400
cycles/64
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MA107040
Abstract: No abstract text available
Text: MITSUBISHI IS Is DRAM MODULE FAST PAGE MODE DYNAMIC RAM 8 M X 4 0 320 M B I T Max. Access T ype name Load m em ory tim e O u tw a rd d im e n sio n s Data shee-; W x H x D (m m ) page 107.95 x 29.5 x 8.6 3 /1 9 (ns) MH8M40AJ-6 ★ MH8M40NAJ-6 ★ MH8M40AJ-7
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MH8M40AJ-6
MH8M40NAJ-6
MH8M40AJ-7
MH8M40NAJ-7
335544320-BIT
8388608-WQRD
40-BIT)
8388608-word
MH8M40AJ
MH8M40NAJ
MA107040
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