TSOP 28 PIN TRAY Search Results

TSOP package tray

Abstract: JEDEC TRAY DIMENSIONS tsop 28 PIN tray JEDEC tray standard tsop TSOP I SSD-A-H7033-1
Contextual Info: TRAY CONTAINER 119.9 HEAT PROOF 7 135° CMAX PPE A' 8.15 10.90 8.00 A NEC TSOP 1 8x13.4 12×18=216 17.20 11.30 13.74 292.4 315.0 (322.6) SECTION A – A' 13.74 5.62 (6.35) 10.00 7.62 135.9 UNIT : mm Applied Package 28-pin Plastic TSOP (I) (8×13.4) 32-pin Plastic TSOP (I) (8×13.4)

Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 28 pin TSOP (II) (400 mil) 28 15 F E P detail of lead end 1 14 A D M M C L B G K N I J H NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL18 Mounting Pad 28 pin TSOP (II) (400 mil) 28 15 1 P E F detail of lead end 14 A H I K G J N C D M B L M NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition.

TRAY TSOP

Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL18 Mounting Pad 28 pin TSOP (II) (400 mil) 15 28 F P E detail of lead end 14 1 A D M M C L B G K N I J H NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL18 Mounting Pad 28 pin TSOP (II) (400 mil) 28 15 1 P E F detail of lead end 14 A H I K G J N C D M B L M NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL18 28 pin TSOP (II) (400 mil) 28 15 E 3°±3° F detail of lead end 1 14 A H I K G J N C D B L M M S28G5-50-7JD-2 NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at

S28G5-50-7JD2-1

Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL18 Mounting Pad 28 pin TSOP (II) (400 mil) 28 15 E 5°±5° F detail of lead end 1 14 A H I K G J N B C D M L M S28G5-50-7JD2-1 NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at

Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL18 Mounting Pad 28 pin TSOP (II) (400 mil) 28 15 F E 5°±5° detail of lead end 1 14 A D M M C B L G K N I H J S28G5-50-7KD2-1 NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at

AD14

Abstract: TRAY TSOP S28G5-50-7KD2
Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL18 Mounting Pad 28 pin TSOP (II) (400 mil) 15 28 3°±3° F E detail of lead end 1 A D 14 M M C L B G K N I H J S28G5-50-7KD-2 NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at

Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL18 Mounting Pad 28 pin TSOP (II) (400 mil) 28 15 F E 3°±3° detail of lead end 1 14 A D M M C B L G K N I J H S28G5-50-7KD1-1 NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at

TSOP package tray

Contextual Info: TRAY CONTAINER Unit : mm 335±1.0 15.5±0.5 304±0.5 PP A' A 14 137.5±0.5 11.2 NEC LA-2542B-1 HEAT PROOF SECTION A − A' 11.2 8.2 5.8 6.2 8.8 180±1.0 21.25±0.5 27.5±0.1 16±0.1 Applied Package 28-pin plastic TSOP I (8x13.4) 32-pin plastic TSOP (I) (8×13.4)

Contextual Info: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL18 28 pin TSOP (II) (400 mil) 28 15 detail of lead end F P E 1 14 A H I G B C N D M S S J L K M NOTE 1. Controlling dimension millimeter. 2. Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL18 28 pin TSOP (II) (400 mil) 28 15 detail of lead end F E 1 14 A D M P M S N C S B K L G I J H NOTE 1. Controlling dimension millimeter. 2. Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition.

TSOP package tray

Abstract: TRAY DIMENSIONS TSOP 62 Package TSOP TRAY tray tsop 1220 JEDEC tray standard tsop
Contextual Info: TRAY CONTAINER UNIT : mm HEAT PROOF 7 12.20 18.80 A' 20.42 14.56 285.88 315.0 322.6 SECTION A-A' 18.80 5.62 (6.35) 15.00 7.62 135.9 PPE NEC 135°C MAX 13.67 13.27 TSOP(2)400MIL18 109.36 9x15=135 A Applied Package Quantity (pcs) 28-pin Plastic TSOP (II)

TRAY TSOP

Contextual Info: Packing NEC Tray JEDEC Tray Name LA-1006B-1 TSOP 2 400MIL18 Mounting Pad 28 pin TSOP (II) (400 mil) 28 15 E 3°±3° F detail of lead end 1 14 A H I K G J N C D B L M M S28G5-50-7JD1-1 NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at

Contextual Info: Unit : mm 335±1.0 15.5±0.5 304±0.5 PP A' A 14 137.5±0.5 11.2 NEC LA-2542B-1 HEAT PROOF SECTION A − A' 11.2 8.2 5.8 6.2 8.8 180±1.0 21.25±0.5 27.5±0.1 16±0.1 Applied Package 28-pin plastic TSOP I (8x13.4) 32-pin plastic TSOP (I) (8×13.4) Quantity (pcs)

TSOP 54 tray

Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL22 Mounting Pad 54 pin TSOP (II) (400 mil) 54 28 detail of lead end F E 1 P 27 A H J I G C D M L N K M B NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.

JEDEC tray standard tsop

Abstract: TSOP 28 Package TSOP package tray JEDEC TRAY DIMENSIONS
Contextual Info: UNIT : mm HEAT PROOF 7 109.36 PPE NEC 135°C MAX 13.67 13.27 TSOP 2 400MIL18 18.8 A' 20.42 14.56 285.88 315.0 (322.6) SECTION A-A' 18.8 5.62 (6.35) 15.0 7.62 135.9 9x15=135 12.2 A Applied Package Quantity (pcs) 28-pin Plastic TSOP(II)(400mil) MAX. 135 Material

Contextual Info: Mounting Pad Packing NEC Tray Name LA-2542B-1 28 pin TSOP I (8 x 13.4) 1 28 detail of lead end Q R S 14 15 K M D N M H L C I J A B G P NOTE (1) Each lead centerline is located within 0.08 mm (0.003 inch) of its true position (T.P.) at maximum material condition.

transistor bc 331 datasheet

Abstract: BC 331 BC 331 Transistor
Contextual Info: Mounting Pad Packing NEC Tray Name LA-2542B-1 28 pin TSOP I (8 x 13.4) 1 28 detail of lead end S R 14 Q 15 P J I A G H L B C N D M M K NOTE (1) Each lead centerline is located within 0.08 mm (0.003 inch) of its true position (T.P.) at maximum material condition.

TSOP package tray

Contextual Info: UNIT : mm 335±1.0 23.5±0.5 288±0.5 A' 12.85 A NEC LA-2526B-1 22.1 HEAT PROOF SECTION A-A' 22.1 18.6 5.8 6.3 8.8 180±1.0 137.5±0.5 27.5±0.1 21.25±0.5 32±0.1 Applied Package Quantity pcs Tray LA-2526B-1 Carbon PP 28-pin • Plastic TSOP (II)(400mil)

Contextual Info: Unit : mm 335±1.0 288±0.5 23.5±0.5 180±1.0 137.5±0.5 21.25±0.5 27.5±0.1 32±0.1 A' 12 NEC LA - 1006B - 1 18.6 HEAT PROOF A SECTION A – A' 12 5.8 6.3 8.8 9 Applied Package Quantity pcs Tray LA-1006B-1 Carbon PF 28-pin plastic TSOP (II) (400mil) MAX. 60

pd0008

Abstract: tray 8 x 8 TSOP TRAY 40 PIN TSOP package tray N1N213 Package and Packing Information ST
Contextual Info: PD0008 Packing information Tray for TSOP packages type 1 Introduction TSOP type-1 packages can be supplied in tray packing. Refer to Table 1 for the list of TSOP type-1 packages supplied in trays. The objective of this document is provide a detailed description of the tray. It applies to all

MD300-10A

Abstract: QFN tray tray datasheet bga SIP 400B TSOP TRAY 40 PIN BGA package tray 64 NEC A39A 240 TSOP package tray 6-tsop TRAY DIMENSIONS 132 PGA
Contextual Info: CHAPTER 4 CHAPTER 4 4.1 PACKING STYLES AND NOTES 4.1.1 Packing Styles 4.1.2 Notes on Handling 4.2 PACKING OF IC PACKAGES 4.2.1 List of Packing 1 DIP (2) SIP, V-DIP, ZIP (3) QUIP, Piggyback (4) PGA (5) SOP, SSOP (6) TSOP (I) (II) (7) QFP, QFP (FP) (8) SVP