TSOP 32 socket
Abstract: Yamaichi socket adapters Intel 48 TSOP Yamaichi SSOP socket adapters wand intel manual TSOP 48 socket
Text: SOCKETS/SOCKET TOOLS INTEL TSOP Precision Vacuum Wand • ■ ■ ■ ■ ■ ■ Reduces bent leads Increases process throughput time Minimizes handling Utilizes guide pins Eliminates manual alignments Works with Yamaichi* TSOP sockets and Intel TSOP trays
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flashwandkit/807908
TSOP 32 socket
Yamaichi socket adapters
Intel 48 TSOP
Yamaichi SSOP socket adapters
wand
intel manual
TSOP 48 socket
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pd0008
Abstract: tray 8 x 8 TSOP TRAY 40 PIN TSOP package tray N1N213 Package and Packing Information ST
Text: PD0008 Packing information Tray for TSOP packages type 1 Introduction TSOP type-1 packages can be supplied in tray packing. Refer to Table 1 for the list of TSOP type-1 packages supplied in trays. The objective of this document is provide a detailed description of the tray. It applies to all
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PD0008
105cm.
PD0008
tray 8 x 8
TSOP TRAY 40 PIN
TSOP package tray
N1N213
Package and Packing Information ST
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TSOP package tray
Abstract: JEDEC TRAY DIMENSIONS tsop 28 PIN tray JEDEC tray standard tsop TSOP I SSD-A-H7033-1
Text: TRAY CONTAINER 119.9 HEAT PROOF 7 135° CMAX PPE A' 8.15 10.90 8.00 A NEC TSOP 1 8x13.4 12×18=216 17.20 11.30 13.74 292.4 315.0 (322.6) SECTION A – A' 13.74 5.62 (6.35) 10.00 7.62 135.9 UNIT : mm Applied Package 28-pin Plastic TSOP (I) (8×13.4) 32-pin Plastic TSOP (I) (8×13.4)
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28-pin
32-pin
SSD-A-H7033-1
TSOP package tray
JEDEC TRAY DIMENSIONS
tsop 28 PIN tray
JEDEC tray standard tsop
TSOP I
SSD-A-H7033-1
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TSOP 48 thermal resistance
Abstract: TSOP 48 stacked die package MS-024 MO-142 TSOP 32 thermal resistance TSOP 48 package tray MO-183 marking code 56l jedec ms-024
Text: LEADFRAME data sheet TSOP Features: Thin Small Outline Package TSOP : Amkor offers a family of popular TSOP packages to serve the needs of IC designers, PCB/system engineers and component specifiers. Small and thin, these 1.0 mm thick packages were designed and introduced to operate
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MS-024
TSOP 48 thermal resistance
TSOP 48 stacked die package
MS-024
MO-142
TSOP 32 thermal resistance
TSOP 48 package tray
MO-183
marking code 56l
jedec ms-024
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SIGNETICS
Abstract: JEDEC tray standard 13 Signetics OR Mullard package tray outline 12X20 signetics data
Text: Signetics Flip Chip Package Data Sheet Signetics Data Sheet Signetics TSOP Type 2 Signetics Thin Small Outline Package Type2 Cross Section View of TSOP Type 2 Mold Compound Gold Wire Lead frame Die Die Attach Adhesive Signetics’ s TSOP Type 2 package is available in 50 lead counts with 0.80mm lead pitches
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12x20
SIGNETICS
JEDEC tray standard 13
Signetics OR Mullard
package tray outline
signetics data
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TSOP 48 thermal resistance
Abstract: TSOP 48 thermal resistance type1 thin TSOP 8x20 package tray TSOP 32 thermal resistance TSOP 48 package tray JEDEC tray standard 13 Ablestik 12-1 signetics TSOP package tray TSOP1-48
Text: Signetics Flip Chip Package Data Sheet Signetics Data Sheet Signetics TSOP Type 1 Signetics Thin Small Outline Package Type1 Cross Section View of TSOP Type 1 Mold Compound Gold Wire Lead frame Die Die Attach Adhesive Signetics’ s TSOP Type1 packages are available in 32 - 48 lead counts with 0.50mm lead
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12x20
TSOP 48 thermal resistance
TSOP 48 thermal resistance type1
thin TSOP 8x20 package tray
TSOP 32 thermal resistance
TSOP 48 package tray
JEDEC tray standard 13
Ablestik 12-1
signetics
TSOP package tray
TSOP1-48
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TSOP package tray
Abstract: JEDEC TRAY DIMENSIONS 10936 TSOP TRAY
Text: HEAT PROOF 7 A' 12 13.67 135°C MAX. PPE 135.9 13.27 A NEC TSOP 2 400MIL21 9x13=117 109.36 UNIT : mm 21.1 22.96 19.74 275.52 315.0 (322.6) SECTION A – A' 21.1 5.62 (6.35) 7.62 18.0 Applied Package Quantity (pcs) 32-pin Plastic TSOP(II)(400mil) 50-pin Plastic TSOP(II)(400mil)
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400MIL21
32-pin
400mil)
50-pin
400MIL21
TSOP package tray
JEDEC TRAY DIMENSIONS
10936
TSOP TRAY
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s29al004d55
Abstract: S29AL016D70TFI010 am29LV8000 S29PL064J70BFI120 S29AL016D70BFI020 Am29LV8000B S29JL064H90TFI000 S29AL008D70TFI020 S29JL032H70TFI020 S29JL032
Text: ORDERING PART NUMBER MAPPING GUIDE March, 2005 Release AMD PRODUCTS FUJITSU PRODUCTS SPANSION PRODUCTS Am29LV400B S29AL004D Am29LV800B/D S29AL008D Am29LV160D MBM29LV160TE/BE S29AL016D Am29LV160M S29AL016M Am29DL32xG TSOP MBM29DL32xE • MBM29DL32F • MBM29DL34F (TSOP)
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Am29LV400B
S29AL004D
Am29LV800B/D
S29AL008D
Am29LV160D
MBM29LV160TE/BE
S29AL016D
Am29LV160M
S29AL016M
Am29DL32xG
s29al004d55
S29AL016D70TFI010
am29LV8000
S29PL064J70BFI120
S29AL016D70BFI020
Am29LV8000B
S29JL064H90TFI000
S29AL008D70TFI020
S29JL032H70TFI020
S29JL032
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JEDEC tray standard
Abstract: JEDEC TRAY DIMENSIONS JEDEC tray standard tsop TRAY TSOP TSOP package tray H6115 TSOP TRAY TRAY DIMENSIONS SSD-A-H6115-2
Text: TRAY CONTAINER HEAT PROOF A' 12.00 7 135°C MAX. PPE 109.36 13.67 13.27 A NEC TSOP 2 400MIL21 9x13=117 21.10 22.96 19.74 275.52 315.0 (322.6) SECTION A – A' 21.10 5.62 (6.35) 18.00 7.62 135.9 UNIT : mm Applied Package Quantity (pcs) 32-pin Plastic TSOP (II)
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400MIL21
32-pin
50-pin
400MIL21
SSD-A-H6115-2
JEDEC tray standard
JEDEC TRAY DIMENSIONS
JEDEC tray standard tsop
TRAY TSOP
TSOP package tray
H6115
TSOP TRAY
TRAY DIMENSIONS
SSD-A-H6115-2
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TSOP package tray
Abstract: TRAY DIMENSIONS TSOP 62 Package TSOP TRAY tray tsop 1220 JEDEC tray standard tsop
Text: TRAY CONTAINER UNIT : mm HEAT PROOF 7 12.20 18.80 A' 20.42 14.56 285.88 315.0 322.6 SECTION A-A' 18.80 5.62 (6.35) 15.00 7.62 135.9 PPE NEC 135°C MAX 13.67 13.27 TSOP(2)400MIL18 109.36 9x15=135 A Applied Package Quantity (pcs) 28-pin Plastic TSOP (II)
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400MIL18
28-pin
44-pin
SSD-A-H6111-2
TSOP package tray
TRAY DIMENSIONS
TSOP 62 Package
TSOP TRAY
tray tsop 1220
JEDEC tray standard tsop
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TSOP 86 Package
Abstract: TSOP 54 tray TSOP package tray TSOP 54 Package TSOP 54 PIN TSOP 66 Package JEDEC tray standard tsop TSOP II 54 Package tsop 66 tsop package
Text: TRAY CONTAINER UNIT : mm HEAT PROOF PRE 7 112.0 NEC 135° MAX. A' 11.8 14.00 12.00 TSOP 2 400MIL22 135.9 9¥12=108 A 24.70 21.70 21.8 271.7 315.0 (322.6) SECTION A – A' 5.62 7.62 (6.35) 21.80 16.50 Applied Package Quantity (pcs) Material 54-pin • Plastic TSOP(II)
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400MIL22
54-pin
66-pin
86-pin
SSD-A-H6023-4
TSOP 86 Package
TSOP 54 tray
TSOP package tray
TSOP 54 Package
TSOP 54 PIN
TSOP 66 Package
JEDEC tray standard tsop
TSOP II 54 Package
tsop 66
tsop package
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TSOP package tray
Abstract: 300mil JEDEC TRAY DIMENSIONS tsop 1230
Text: UNIT : mm HEAT PROOF 111.3 7 PPE NEC 135°C MAX 11.13 12.30 TSOP 2 300MIL17 135.9 11x16=176 A A' 9.2 16.4 19.14 13.95 287.1 315.0 (322.6) SECTION A-A' 16.4 (6.35) 7.62 12.0 5.62 Applied Package Quantity (pcs) 26-pin Plastic TSOP(II)(300mil) MAX. 176 Tray
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300MIL17
26-pin
300mil)
TSOP package tray
300mil
JEDEC TRAY DIMENSIONS
tsop 1230
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TSOP 48 package tray
Abstract: 48-pin TSOP package tray tsop 48 PIN tray TSOP package tray TSOP I JEDEC TRAY DIMENSIONS TRAY TSOP
Text: 150° MAX. 14.90 A 8x12=96 15.80 104.3 TSOP I 12.0×20.0mm A' 12.3 20.3 25.50 17.25 280.5 315.0 322.6 SECTION A – A' 5.62 (6.35) 20.3 7.62 135.9 UNIT : mm Applied Package Quantity (pcs) 48-pin Plastic TSOP (I) (12×20) MAX. 96 Tray Material Heat Proof Temp.
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48-pin
TSOP 48 package tray
48-pin TSOP package tray
tsop 48 PIN tray
TSOP package tray
TSOP I
JEDEC TRAY DIMENSIONS
TRAY TSOP
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TSOP 48 package tray
Abstract: 48-pin TSOP package tray tsop 48 PIN tray JEDEC tray standard TSOP package tray tsop TRAY TSOP TRAY 40 PIN
Text: TRAY CONTAINER UNIT : mm 8x13=104 NEC 7 135°C MAX. 14.90 15.80 A' 23.50 12.10 104.3 TSOP 1 12×18 135.9 PPE A 18.40 282.0 315.0 (322.6) 16.50 SECTION A – A' 5.62 (6.35) 7.62 18.40 Applied Package Quantity (pcs) 48-pin Plastic TSOP (I) (12 × 18) MAX. 104
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48-pin
SSD-A-H6761
TSOP 48 package tray
48-pin TSOP package tray
tsop 48 PIN tray
JEDEC tray standard
TSOP package tray
tsop TRAY
TSOP TRAY 40 PIN
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Untitled
Abstract: No abstract text available
Text: Packing JEDEC Tray Name TSOP 2 400MIL18 Mounting Pad 44 pin TSOP (II) (400 mil) 44 23 1 P E F detail of lead end 22 A H I K G J N C D M B L M NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.
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400MIL18
S44G5-80-7JF5
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TSOP 54 tray
Abstract: No abstract text available
Text: Packing JEDEC Tray Name TSOP 2 400MIL22 Mounting Pad 54 pin TSOP (II) (400 mil) 54 28 detail of lead end F E 1 P 27 A H J I G C D M L N K M B NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.
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400MIL22
S54G5-80-9JF
TSOP 54 tray
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S44G5-80-7KF2
Abstract: No abstract text available
Text: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL18 44 pin TSOP (II) (400 mil) 44 23 P F E detail of lead end 1 22 A D M M N L B G K C I J H NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.
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400MIL18
S44G5-80-7KF2
S44G5-80-7KF2
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Untitled
Abstract: No abstract text available
Text: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 50 pin TSOP (II) (400 mil) 26 50 F P E detail of lead end 1 25 A D M M C B L G K N I J H NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.
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400MIL21
S50G5-80-7KF2
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Untitled
Abstract: No abstract text available
Text: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL21 50 pin TSOP (II) (400 mil) 50 26 E P F detail of lead end 1 25 A H J K G I N B C D M L M NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.
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400MIL21
005Each
S50G5-80-7JF1
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0038 tsop
Abstract: No abstract text available
Text: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 32 pin TSOP (II) (400 mil) 32 17 1 P E F detail of lead end 16 A H J K G I N C D M B L M NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition.
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400MIL21
S32G5-50-7JD2
0038 tsop
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44PINTSOP
Abstract: No abstract text available
Text: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL18 44 pin TSOP (II) (400 mil) 44 23 E P F detail of lead end 1 22 A H I K G J N C D M B L M NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.
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400MIL18
S44G5-80-7JF2
44PINTSOP
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Untitled
Abstract: No abstract text available
Text: Mounting Pad Packing JEDEC Tray Name TSOP 2 300MIL17 26 pin TSOP (II) (300 mil) 26 14 1 P E F detail of lead end 13 A H I K G J N C D M B L M NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition.
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300MIL17
S26G3-50-9JD
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Untitled
Abstract: No abstract text available
Text: Packing JEDEC Tray Name TSOP 2 400MIL18 Mounting Pad 44 pin TSOP (II) (400 mil) 44 23 P F E detail of lead end 1 22 A D M M N L B G K C I J H NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.
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400MIL18
S44G5-80-7KF3
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Untitled
Abstract: No abstract text available
Text: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 50 pin TSOP (II) (400 mil) 50 26 F E P detail of lead end 1 25 A D M M C B L G K N I J H NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.
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400MIL21
00Each
S50G5-80-7KF1
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