WIRE BOND RECOMMENDATIONS Search Results

AWM 20267

Abstract: AWG 28
Contextual Info: 3M Round, Jacketed, Flat Cable .050″ 28 AWG Stranded, Mass-Term, PVC/PVC 3759 Series • Round construction permits easier routing • 28 AWG wire on .050 inch centers permits mass termination to broad line of IDC connectors • Continuous bond and continuous split/bond

AWM 20267

Abstract: TS-0070-C MARKING EU
Contextual Info: 3M Round, Jacketed, Flat Cable .050" 28 AWG Stranded, Mass-Term, PVC/PVC 3759 Series • Round construction permits easier routing • 28 AWG wire on .050 inch centers permits mass termination to broad line of IDC connectors • Continuous bond and continuous split/bond allows

E118773

Abstract: AWM 20267
Contextual Info: 3M Round, Jacketed, Flat Cable .050" 28 AWG Stranded, Mass-Term, PVC/PVC 3759 Series • Round construction permits easier routing • 28 AWG wire on .050 inch centers permits mass termination to broad line of IDC connectors • Continuous bond and continuous split/bond allows

AWM 20267

Abstract: MARKING EU
Contextual Info: 3M Round, Jacketed, Flat Cable .050" 26 AWG Stranded, Mass-Term, PVC/PVC 3758 Series • Round construction permits easier routing • 26 AWG wire on .050 inch centers permits mass termination to broad line of IDC connectors • Continuous bond and continuous split/bond allows

nsmd smd

Abstract: AND8195 SO8FL Solder paste stencil life AND8195/D 020C 1505C
Contextual Info: AND8195/D Board Mounting Notes for SO8−Flat Lead Prepared by: Steve St. Germain, Phil Celaya, and Isauro Amaro ON Semiconductor http://onsemi.com APPLICATION NOTE INTRODUCTION Wire Bond Various ON Semiconductor devices are packaged in an advanced power leadless package named Quad Flat

SO8FL

Abstract: FOOTPRINT PCB nsmd smd stencil tension WS3060 so8 pcb pattern 1505C 020C
Contextual Info: AND8195/D Board Mounting Notes for SO8−Flat Lead Prepared by: Steve St. Germain, Phil Celaya, and Isauro Amaro ON Semiconductor http://onsemi.com APPLICATION NOTE INTRODUCTION Wire Bond Various ON Semiconductor devices are packaged in an advanced power leadless package named Quad Flat

Contextual Info: G•SiC Technology XBright® Plus LEDs CxxxXB290-S0100-A-Plus Features • • • Applications XBright® Plus Performance – 15.0 mW min Blue • Outdoor LED Video Displays • Automotive Dashboard Lighting Single Wire Bond Structure • White LEDs

Contextual Info: G•SiC Technology XBright® LEDs Cxxx-XB290-S0100-A Features • Applications XBright® Performance – 12.0 mW min Blue • Outdoor LED Video Displays • Automotive Dashboard Lighting • Single Wire Bond Structure • Class II ESD Rating • White LEDs

Contextual Info: G•SiC Technology XBright® Plus LEDs CxxxXB290-S0100-A-Plus Features • Applications XBright® Plus LED Performance – 15.0 mW min Blue • Single Wire Bond Structure • Class II ESD Rating • Outdoor LED Video Displays • Automotive Dashboard Lighting

Contextual Info: G•SiC Technology XBright LEDs CxxxXB290-S0100-A Features • XBright Applications • Outdoor LED Video Displays LED Performance – 12.0 mW min Blue 460nm and 470nm • Automotive Dashboard Lighting – 7.0 mW min Green (527nm) • White LEDs • Single Wire Bond Structure

awm style 3239 vw-1 24 awg

Abstract: MARKING EU 101XX-8X00EE 20596
Contextual Info: 3M Round, Jacketed, Flat Cable .025" 30 AWG Stranded, Mass-Term, PVC/PVC 3896 Series • Round construction permits easier routing • 30 AWG wire on .025 inch centers permits mass termination • Continuous split/bond allows for mass termination on 2.4 inch centers approximate

Cxxx-XB290-S0100-A-Plus

Abstract: C460XB290-0105-A C460XB290-0106-A C460XB290-0107-A C460XB290-0108-A C470XB290-0105-A C470XB290-0106-A C470XB290-0107-A OS4000
Contextual Info: G•SiC Technology XBright® Plus LEDs Cxxx-XB290-S0100-A-Plus Features • Applications XBright® Plus Performance – 15.0 mW min Blue • Outdoor LED Video Displays • Automotive Dashboard Lighting • Single Wire Bond Structure • Class II ESD Rating

AWM 20267

Abstract: E118773
Contextual Info: 3M Round, Shielded/Jacketed, Flat Cable .050″ 28 AWG Stranded, Mass Terminatable, PVC/PVC 3659 Series • Round construction permits easier routing • 28 AWG wire on .050 inch pitch permits mass termination to broad line of IDC connectors • Continuous split/bond repeat allows for mass

3m 3659

Abstract: 365914300sf
Contextual Info: 3M Round, Shielded/Jacketed, Flat Cable .050" 28 AWG Stranded, Mass Terminatable, PVC/PVC 3659 Series • Round construction permits easier routing • 28 AWG wire on .050 inch pitch permits mass termination to broad line of IDC connectors • Continuous split/bond repeat allows for mass

AWM 20267

Contextual Info: 3M Round, Shielded/Jacketed, Flat Cable .050" 28 AWG Stranded, Mass Terminatable, PVC/PVC 3659 Series • Round construction permits easier routing • 28 AWG wire on .050 inch pitch permits mass termination to broad line of IDC connectors • Continuous split/bond repeat allows for mass

AWM 20267

Abstract: AWM IIA/B
Contextual Info: 3M Round, Shielded/Jacketed, Flat Cable .050″ 28 AWG Stranded, Mass-Term, PVC/PVC 3659 Series S Round construction permits easier routing S 28 AWG wire on .050 inch pitch permits mass termination to broad line of IDC connectors S Continuous split/bond repeat allows for mass

1N23 diode

Abstract: SINGLE ENDED MIXER 1N23 ALPHA 1N23 Diode Holder surface mount zero-bias detector diode silicon di for microwave diode mixer x-band motion detector metal diode Silicon Point Contact Mixer Diodes zero bias diode
Contextual Info: Application Note 80800: Mixer and Detector Diodes 2. BONDED CONTACT This construction features a gold wire bonded from the rim of the package to a bonding pad on the chip and then to the rim opposite the first bond. A cap is then soldered to this rim thus completing the assembly and

AuSn eutectic

Abstract: wire bond recommendations Die Attach and Bonding Guidelines Gan on silicon transistor Gan on silicon substrate AN008 DIE BONDER
Contextual Info: Application Note AN-008 Die Attach and Bonding Recommendations Introduction While Nitronex’s core market is packaged RF products, we sell die to select customers for use in modules and subsystems. One benefit of Nitronex GaN devices is they are fabricated on industry standard silicon wafers so

GaAs MMIC ESD, Die Attach and Bonding Guidelines

Abstract: RDE capacitor HMMC-5021 HMMC-5022 HMMC-5025 HMMC-5026 HMMC-5027
Contextual Info: Agilent GaAs MMIC TWA Users Guide Application Note # 56 - Revision A January 2001 Includes: 1. Device Schematic, Topology, and Theory of Operation Descriptions 2. Assembly, Bonding, & Biasing Recommendations 3. Extended Low-Frequency Operation Assembly Guidelines

84-1 CONDUCTIVE EPOXY

Abstract: copper bond wire
Contextual Info: RECOMMENDATIONS FOR MOUNTING AND BONDING GaAs MMIC CHIPS Die or Chip Mounting It is important that GaAs chips are mounted correctly to avoid significant increase in thermal impedance and to avoid consequent damage during wire bonding. This is particularly important for large area chips such as MMIC's

BT22

Contextual Info: RECOMMENDATIONS FOR MOUNTING AND BNDING GaAs MMIC CHIPS Die or Chip Mounting It is important that GaAs chips are mounted correctly to avoid significant increase in thermal impedance and to avoid consequent damage during wiring bonding. This is particularly important for large area chips such as MMIC’s

transistor tip 1050

Abstract: HBT transistor PH ON 823 0728 tip 410 transistor
Contextual Info: MMT501 InGaP HBT Transistor DEVICE HANDLING RECOMMENDATIONS ESD These devices are Class 1 devices 0–500 V for Electrostatic Discharge Sensitivity (ESD) and must be handled accordingly to prevent damage. Proper ESD precautions should be observed during all

bond wire copper

Abstract: copper bond wire
Contextual Info: 0 O P T E K Application Bulletin 211 July 1989_ Recommendations for Soldering T-1 3/4 Plastic Encapsulated Discrete Components_ Plastic encapsulated components such as T-1 3/4

asm eagle

Abstract: WHP-002 flux-eutectic 2151-HTV21-CT-series CPR3-AN03 EZ290 bonding wire cree UP78 EZ1000 1572-17-437GM-20D
Contextual Info: EZBright LED Handling and Packaging Recommendations This applications note provides the user with a basic understanding of Cree’s EZBright LED chips, as well as recommendations on handling and packaging. Cree’s EZBright LEDs are the next generation of solid-state LED emitters that combine highly efficient InGaN materials