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Brady Worldwide Inc 7135-1HV-PK B946 7135-1HV BK/YW 5PK
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	7135-1HV-PK	Bulk			1	1 $33.5 10 $33.5 100 $33.5 1000 $33.5 10000 $33.5	Buy Now
RS	7135-1HV-PK	Package		4 Weeks	1	1 $32.89 10 $32.89 100 $32.89 1000 $32.89 10000 $32.89	Get Quote
NXP Semiconductors UDA1351H/N1,551 IC DAC/AUDIO 24BIT 100K 44PQFP
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	UDA1351H/N1,551	Tray				1 - 10 - 100 - 1000 - 10000 -	Buy Now
NXP Semiconductors UDA1351H/N1,557 IC DAC/AUDIO 24BIT 100K 44PQFP
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	UDA1351H/N1,557	Tray				1 - 10 - 100 - 1000 - 10000 -	Buy Now
Samtec Inc HTMS-113-51-H-D Conn Unshrouded Header HDR 26 POS 1.27mm Solder ST Thru-Hole - Bulk (Alt: HTMS-113-51-H-D) Free Sample
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Avnet Americas	HTMS-113-51-H-D	Bulk			1	1 - 10 - 100 - 1000 - 10000 -	Get Quote
Master Electronics	HTMS-113-51-H-D					1 - 10 $4.87 100 $3.16 1000 $2.98 10000 $2.47	Buy Now
Sager	HTMS-113-51-H-D					1 - 10 - 100 - 1000 - 10000 -	Buy Now
Bimba Manufacturing Company FO-313.5-1HD 1-1/2in Bore ; Stroke: 0.312 Inch(s); Screw Clearance Holes, Front [4F] \| Bimba FO-313.5-1HD
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
RS	FO-313.5-1HD	Bulk		5 Weeks	1	1 $177.1 10 $177.1 100 $177.1 1000 $177.1 10000 $177.1	Get Quote

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1351H Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
NEC asu Abstract: 13E3h 1442H Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid	Original	PDF	R8C/22 R8C/23 REJ09B0251-0200 NEC asu 13E3h 1442H
13CD Abstract: MA 1360H 13BFh 1344H R5F21226JFP R5F21226KFP R5F21227JFP R5F21227KFP 1421H 1447H Text: PRELIMINARY Notice: This is not a final specification. Some parametric limits are subject to change. R8C/22, R8C/23 Group SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER 1. REJ03B0097-0020 Rev.0.20 Sep 29, 2005 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is	Original	PDF	R8C/22, R8C/23 16-BIT REJ03B0097-0020 48-pin 13CD MA 1360H 13BFh 1344H R5F21226JFP R5F21226KFP R5F21227JFP R5F21227KFP 1421H 1447H
1312H Abstract: 144BH 1458h 1351h 13D0H 1444H Text: R8C/22 Group, R8C/23 Group RENESAS MCU 1. REJ03B0097-0100 Rev.1.00 Oct 27, 2006 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level	Original	PDF	R8C/22 R8C/23 REJ03B0097-0100 48-pin 1312H 144BH 1458h 1351h 13D0H 1444H
SI 1340H Abstract: 1542H mx-126 1488h integrators si 1340h PSL 26 SA8 357 T1E1-7 DATA SHEET Equivalent MX12 MX23 Text: PM5365 TEMAP STANDARD PRODUCT REGISTER DESCRIPTION PMC-1990682 ISSUE 2 HIGH DENSITY VT/TU MAPPER AND M13 MULTIPLEXER PM5365 TEMAP HIGH DENSITY VT/TU MAPPER AND M13 MULTIPLEXER REGISTER DESCRIPTION Proprietary and Confidential ISSUE 2: JULY 2001 PMC-Sierra, Inc.	Original	PDF	PM5365 PMC-1990682 PM5365 PMC-1990682 SI 1340H 1542H mx-126 1488h integrators si 1340h PSL 26 SA8 357 T1E1-7 DATA SHEET Equivalent MX12 MX23
1257h Abstract: 1488h 1542H 1250H 200H MX12 PM4328 PM5362 PM5365 PM8315 Text: TEMUX Programmer's Guide Released PM8315, PM5365, PM4328 TM TEMUX TEMUX, TEMAP, TECT3 HIGH DENSITY T1/E1 FRAMER WITH INTEGRATED VT/TU MAPPER AND M13 MULTIPLEXER Programmer’s Guide Proprietary and Confidential Release Issue 4: November 2001 Proprietary and Confidential to PMC-Sierra, Inc., and for its Customers’ Internal Use	Original	PDF	PM8315, PM5365, PM4328 PMC-1991268, PMC-1991268 120AH: 1257h 1488h 1542H 1250H 200H MX12 PM4328 PM5362 PM5365 PM8315
R5F2123 Abstract: R5F2123CKFP 131Bh R5F2122CJFP R5F21226DFP R5F21226JFP R5F21227DFP R5F21227JFP 1428H R5F21228JFP Text: R8C/22 Group, R8C/23 Group RENESAS MCU 1. REJ03B0097-0110 Rev.1.10 Mar 16, 2007 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level	Original	PDF	R8C/22 R8C/23 REJ03B0097-0110 48-pin R5F2123 R5F2123CKFP 131Bh R5F2122CJFP R5F21226DFP R5F21226JFP R5F21227DFP R5F21227JFP 1428H R5F21228JFP
r5f2122ckfp Abstract: r5f21237jfp R5F21238KFP REJ09B0251-0200 R5F21236JFP R5F2123CKFP 1342H Text: REJ09B0251-0200 16 R8C/22 Group, R8C/23 Group Hardware Manual RENESAS MCU R8C FAMILY / R8C/2x SERIES All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by	Original	PDF	REJ09B0251-0200 R8C/22 R8C/23 r5f2122ckfp r5f21237jfp R5F21238KFP REJ09B0251-0200 R5F21236JFP R5F2123CKFP 1342H
SI 1360H Abstract: 1542H 1488h 1558h PSL 26 MX12 MX23 PM8315 SI 1340H Text: PM8315 TEMUX STANDARD PRODUCT REGISTER DESCRIPTIONS PMC-1990495 ISSUE 5 HIGH DENSITY T1/E1 FRAMER WITH INTEGRATED VT/TU MAPPER AND M13 MUX PM8315 TEMUX HIGH DENSITY T1/E1 FRAMER WITH INTEGRATED VT/TU MAPPER AND M13 MULTIPLEXER REGISTER DESCRIPTIONS Proprietary and Confidential	Original	PDF	PM8315 PMC-1990495 PM8315 SI 1360H 1542H 1488h 1558h PSL 26 MX12 MX23 SI 1340H
NEC 1378h Abstract: R5F2123CKFP 1347h 13F9H R5F21226DFP R5F21226JFP R5F2123 R5F21227JFP R5F21228DFP R5F21228JFP Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid	Original	PDF
145AH Abstract: MA 1360H 1320H 1378H ic r5f2122ckfp R5F2123CKFP 13C4H R5F2122AJFP R5F21226DFP R5F21227DFP Text: R8C/22 Group, R8C/23 Group RENESAS MCU 1. REJ03B0097-0200 Rev.2.00 Aug 20, 2008 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of	Original	PDF	R8C/22 R8C/23 REJ03B0097-0200 48-pin 145AH MA 1360H 1320H 1378H ic r5f2122ckfp R5F2123CKFP 13C4H R5F2122AJFP R5F21226DFP R5F21227DFP
13D2H Abstract: 1429H 1332H R5F2123 1466H 1439H 1423H 1342H 13F9H 1436H Text: PRELIMINARY Notice: This is not a final specification. Some parametric limits are subject to change. R8C/22, R8C/23 Group SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER 1. REJ03B0097-0010 Rev.0.10 Mar 08, 2005 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU	Original	PDF	R8C/22, R8C/23 16-BIT REJ03B0097-0010 48-pin di5-900 Unit2607 13D2H 1429H 1332H R5F2123 1466H 1439H 1423H 1342H 13F9H 1436H
Untitled Abstract: No abstract text available Text: REJ09B0251-0110 16 R8C/22 Group, R8C/23 Group Hardware Manual RENESAS MCU M16C FAMILY / R8C/Tiny SERIES All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by	Original	PDF	REJ09B0251-0110 R8C/22 R8C/23