1466H Search Results

NEC asu

Abstract: 13E3h 1442H
Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid

balanced frequency discriminator

Abstract: CLOCK GENERATOR 10HZ piezo disc transducer Piezo Audio Transducers Plessey ZN488E 14Hz electromagnetic pulse generator Ceramic resonator 7220S13
Contextual Info: P L E S S E Y SEMICONDUCTORS p 7220513 D0 0c1244 7 PLESSEY Sem iconductors. ZN488E T-7S-07-// TONE RINGER G EN ERA L DESCRIPTION F EA TU R ES Full rectifier bridge for direct operation from ringing supply Balanced output for transducers electro m agnetic

HD12 DECODER

Abstract: tr4l CYM1466 146610
Contextual Info: CYM1466 PRELIMINARY CYPRESS SEMICONDUCTOR 512K x 8 SRAM Module Functional Description Features The CYM1466 is a high-performance 4-megabit static RAM module organized as 512K words by 8 bits. This module is constructed using four 128K x 8 RAMs in ceramic leadless chip carrier packages

09-D2

Abstract: RGB565 to rgb888 epson 16F8H T-1228 S2D13719 T-1227 Casio 1026 casio tft T14-22 T1205A
Contextual Info: S2D13719 Mobile Graphics Engine Hardware Functional Specification Document Number: X59A-A-002-01 Status: Revision 1.2 Issue Date: 2008/10/27 SEIKO EPSON CORPORATION 2008. All Rights Reserved. Information in this document is subject to change without notice. You may download and use this document, but only for your own use in

Piezo Audio Transducers

Abstract: balanced frequency discriminator 5V power supply using bridge rectifier of a bridge rectifier IC
Contextual Info: P L E S S E Y SEMICONDUCTORS ^ 7220513 0 0 0 c1244 7 PLESSEY S em ico n d u cto rs. ZN488E T-7S-D7-// TONE RINGER GENERAL DESCRIPTION FEATURES Full rectifier bridge for direct operation from ringing supply Balanced o u tp u t fo r transducers e le ctrom ag ne tic

13CD

Abstract: MA 1360H 13BFh 1344H R5F21226JFP R5F21226KFP R5F21227JFP R5F21227KFP 1421H 1447H
Contextual Info: PRELIMINARY Notice: This is not a final specification. Some parametric limits are subject to change. R8C/22, R8C/23 Group SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER 1. REJ03B0097-0020 Rev.0.20 Sep 29, 2005 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is

1N44H

Abstract: 1a5ah 1178H 1N60H 1171H 1A86H 0m02 1b7ah 19C1H 1N14H
Contextual Info: SONET/SDH Payload Extractor/Aligner SPECTRA-4x155 Production PM5316 SPECTRA 4x155 SONET/SDH Payload Extractor/Aligner 4 x 155 Mbit/s Datasheet Proprietary and Confidential Production Issue 4: March 2001 Proprietary and Confidential to PMC-Sierra, Inc. and for its customers’ internal use

s1d13715

Abstract: 1066H LCD sharp 320X320 T-1228 T-1227 phone 14 pin vga camera pinout T1128 T1429 1520H RGB565 to rgb888 epson
Contextual Info: S1D13715 Mobile Graphics Engine with Megapixel Support Hardware Functional Specification Document Number: X52A-A-001-07 SEIKO EPSON CORPORATION 2002-2008. All Rights Reserved. Information in this document is subject to change without notice. You may download and use this document, but only for your own use in

1466HD-120M

Abstract: 1466h 1466HD
Contextual Info: PRELIM INARY CYM1466 pyppipcq SEMICONDUCTOR 512K x 8 SRAM Module Features Functional Description • T h e CYM 1466 is a high-perform ance 4-m cgabit static R A M module organized as 512K words by 8 bits. T his m odule is constructed using four 128K x 8 R A M s in

1312H

Abstract: 144BH 1458h 1351h 13D0H 1444H
Contextual Info: R8C/22 Group, R8C/23 Group RENESAS MCU 1. REJ03B0097-0100 Rev.1.00 Oct 27, 2006 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level

Contextual Info: CYM1466 PRELIMINARY CYPRESS SEMICONDUCTOR 512Kx 8 SRAM Module Features Functional Description • High-density 4-megabit SRAM module T he CY M 1466 is a high-perform ance 4-m egabit static R A M m odule organized as 512K w ords by 8 bits. T his m odule is

R5F2123

Abstract: R5F2123CKFP 131Bh R5F2122CJFP R5F21226DFP R5F21226JFP R5F21227DFP R5F21227JFP 1428H R5F21228JFP
Contextual Info: R8C/22 Group, R8C/23 Group RENESAS MCU 1. REJ03B0097-0110 Rev.1.10 Mar 16, 2007 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level

1C65H

Abstract: 1a5ah
Contextual Info: :5 6: 55 AM SPECTRA 4x155 ASSP Telecom Standard Product Data Sheet Released m be r, 20 05 12 PM5316 es da y, 13 De ce SPECTRA 4x155 Data Sheet Released Issue No. 6: November 2005 Do wn lo ad ed by Co nt e nt Te a m of P ar tm in er In co n Tu SONET/SDH Payload Extractor/Aligner

r5f2122ckfp

Abstract: r5f21237jfp R5F21238KFP REJ09B0251-0200 R5F21236JFP R5F2123CKFP 1342H
Contextual Info: REJ09B0251-0200 16 R8C/22 Group, R8C/23 Group Hardware Manual RENESAS MCU R8C FAMILY / R8C/2x SERIES All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by

488e

Abstract: Piezo Audio Transducers
Contextual Info: APLESSEY W S e m ico n d u c to rs. ZN488E TONE RINGER FEATURES GENERAL DESCRIPTION • Full rectifier bridge for direct operation from ringing supply The Z N 488E integrated circuit tone ringer is intended to replace existing electromechanical bells in telephone handsets

145AH

Abstract: MA 1360H 1320H 1378H ic r5f2122ckfp R5F2123CKFP 13C4H R5F2122AJFP R5F21226DFP R5F21227DFP
Contextual Info: R8C/22 Group, R8C/23 Group RENESAS MCU 1. REJ03B0097-0200 Rev.2.00 Aug 20, 2008 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of

13D2H

Abstract: 1429H 1332H R5F2123 1466H 1439H 1423H 1342H 13F9H 1436H
Contextual Info: PRELIMINARY Notice: This is not a final specification. Some parametric limits are subject to change. R8C/22, R8C/23 Group SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER 1. REJ03B0097-0010 Rev.0.10 Mar 08, 2005 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU

Contextual Info: 2: 03 PM SPECTRA 4x155 ASSP Telecom Standard Product Data Sheet Released m be r, 20 02 02 :4 PM5316 da y, 03 De ce SPECTRA 4x155 Data Sheet Released Issue No. 5: September 2002 Do wn lo ad ed by Pa rtM i ne rI nc of Pa rtm in er In co n Tu es SONET/SDH Payload Extractor/Aligner

Contextual Info: REJ09B0251-0110 16 R8C/22 Group, R8C/23 Group Hardware Manual RENESAS MCU M16C FAMILY / R8C/Tiny SERIES All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by