33 AJ Search Results

Contextual Info: DO NOT SC A LE D IM E N S IO N IN w P R O JE C T D R A W IN G CD M E T R IC NO. S IM IL A R ITEM DWG. NO. o S D -6 8 1 2 4-00 2 T Y P HΠI 33- HΠI 33- HSE 33- HΠI 33- HΠI 33- HΠI 33- HOE 33- HUE 33- o CD >E=3< > o o a a oo o 2 . 5 4 R E V IS E D O

P5-87831-027

Contextual Info: 10 C IR C U IT tt RIBS A S S E M B L Y P /N P A C K E D IN T U B E W IT H K A P T O N ] 87833-0-431 878 33 -0 4 41 8 78 33-0451 878 33-0631 8 78 33-0641 8 78 33-0651 3.65 878 33 -0 8 31 878 33 -0 8 41 878 33 -0 8 51 10.65 LO C ATIO N V A R IE S ON A S S E M B L Y P /N

itt lotti

Abstract: NJL5802K
Contextual Info: CSJ o co LTD A f\ ffl * si □[r -R 33 ¡ lir a +r IN •R 33 o « ^ i ib, Hli •4= In' kH V -ir i>\ £ * -e .Í. T s i i ~x K& f o ^ l>h I »£ S -R E« •p; 33 AJ = - 33 K* -R . ■ !£ li* [N => - I «S •k- il 'S m ! -i- HI N $i A n r* ’’iQ '\ ÜË

Contextual Info: COM’L: -25/33 il MIL: -25 Am29CPL151H-25/33 Advanced Micro Devices CMOS 64-Word Field-Programmable Controller FPC DISTINCTIVE CHARACTERISTICS • Implements complex state machines Up to 33-MHz maximum frequency ■ High-speed, low-power CMOS EPROM technology

DPM 10

Abstract: Lascar Electronics IC1 INTERCONNEXIONS 3.5 digit dpm
Contextual Info: DIMENSIONS ABMESSUNGEN DIMENSIONS DIMENSIONI All dimensions in mm inches Panel cut-out 68 x 33 (2.68 x 1.30) Alle Abmessungen in mm (Zoll) Einbauausschnitt 68 x 33 (2,68 x 1,30) Tutte le dimensioni sono espresse in mm (pollici) Finestra pannello 68 x 33 (2,68 x 1,30)

DPM-40

Abstract: DPM 40 precision 4-20ma current source "DPM 40"
Contextual Info: DIMENSIONS ABMESSUNGEN DIMENSIONS DIMENSIONI All dimensions in mm inches Panel cut-out 68 x 33 (2.68 x 1.30) Alle Abmessungen in mm (Zoll) Einbauausschnitt 68 x 33 (2,68 x 1,30) Tutte le dimensioni sono espresse in mm (pollici) Finestra pannello 68 x 33 (2,68 x 1,30)

Contextual Info: Chapitre 33. Chaînes de caractères 33 Manipulations de chaînes de caractères . Définition directe . Génération de caractères . Concaténation .

DPM 40

Abstract: "DPM 40"
Contextual Info: GB DIMENSIONS D DIMENSIONS I All dimensions in mm inches Panel cut-out 68 x 33 (2.68 x 1.30) F ABMESSUNGEN Alle Abmessungen in mm (Zoll) Einbauausschnitt 68 x 33 (2,68 x 1,30) DIMENSIONI Tutte le dimensioni sono espresse in mm (pollici) Finestra pannello 68 x 33 (2,68 x 1,30)

display led 7 segmenti

Contextual Info: GB DIMENSIONS D DIMENSIONS I All dimensions in mm inches Panel cut-out 68 x 33 (2.68 x 1.30) F ABMESSUNGEN Alle Abmessungen in mm (Zoll) Einbauausschnitt 68 x 33 (2,68 x 1,30) DIMENSIONI Tutte le dimensioni sono espresse in mm (pollici) Finestra pannello 68 x 33 (2,68 x 1,30)

Contextual Info: 1023X ¿Zi 0.2 A 33 14.7 '1 4 .5 ' A1 INDEX- / / 0.25 6.6 h MAX 1 ~ 7.725 MAX SEATING PLANE : A -F = F 12.1 11.9 2X 8.65 MIN 33 -b = H 4X CAP ZONES h 2X 10.7 MIN 4X 14 M AX- 4X ^ 0.2 2X 7.895 MAX — 2X 9.05 MAX TOP VIEW 31X 1 0.5 L AJ AH ! j j ! !! !! : : : : :

MS-034

Abstract: n 332 ab sot683 HBGA960
Contextual Info: PDF: 2001 Apr 24 Philips Semiconductors Package outline HBGA960: plastic, heatsink ball grid array package; 960 balls; body 33 x 33 x 2.4 mm SOT683-1 B D A D1 ball A1 index area A3 A E1 E A2 A1 detail X e1 b e AL AJ AG AE AC AA W U R N L J G E C A ∅w M AF

LED DISPLAY starburst

Abstract: led infrarouge led infrarossi
Contextual Info: GB DIMENSIONS D All dimensions in mm inches Panel cut-out 68 x 33 (2.68 x 1.30) Alle Abmessungen in mm (Zoll) Einbauausschnitt 68 x 33 (2,68 x 1,30) PANEL FITTING EINBAUHINWEISE Lokalisieren Sie das Gerät durch die Vorderseite des Gehäuseausschnitts und schieben es vorsichtig ein, bis

RAYTHEON

Abstract: Raytheon Company RMWT11001
Contextual Info: RMWT11001 11-33 GHz Tripler MMIC PRODUCT INFORMATION Description Features The RMWT11001 is an 11 to 33 GHz Tripler designed to be used in the LO chain of point to point radios, point to multi-point communications, LMDS, and other millimeter wave applications. In conjunction with other Raytheon

DPM200

Abstract: DPM200S dpm negative rail 200S DISPLAY 3 CIFRE facon
Contextual Info: DIMENSIONS D All dimensions in mm inches Panel cut-out 68 x 33 (2.68 x 1.30) Alle Abmessungen in mm (Zoll) Einbauausschnitt 68 x 33 (2,68 x 1,30) PANEL FITTING EINBAUHINWEISE Lokalisieren Sie das Meßgerät, indem Sie es durch den Gehäuseausschnitt einführen und die Plastikfederclips

Contextual Info: Numeric Display 3 Digit 7. 6mm . 3 ” Series Pi n No. Type No. Lighting Color Assignment Assignment 1 Cathode g1 Anode L N 5 33 Y A M Y .Am ber 2 Cathode e1 Anode e1 L N 5 33 Y K M Y .Am ber 3 Cathode d1

Contextual Info: CXK784862Q-33/50 SONY 33/50Mhz FEATURES DESCRIPTION * Single Chip Cache Subsystem for 486 CPU The SONY Cache-2 is a single chip cache sub­ system designed to work with the 486SX/DX/DX2 microprocessors at frequencies up to 50MHz. This device is designed utilizing SO NY’S proprietary

Contextual Info: Package outline HBGA960: plastic thermal enhanced ball grid array package; 960 balls; body 33 x 33 x 2.4 mm; heatsink B D SOT683-1 A ball A1 index area A A2 E A1 detail X C e1 ∅v M C A B b e y y1 C ∅w M C AK AH AF AD AB Y V T P M AL AJ AG AE AA F D B heatsink

DPM 2000

Abstract: dpm2000 200S 3.5 digit dpm DPM200 DPM2000S
Contextual Info: DIMENSIONS ABMESSUNGEN All dimensions in mm inches Panel cut-out 68 x 33 (2.68 x 1.30) Alle Abmessungen in mm (Zoll) Einbauausschnitt 68 x 33 (2,68 x 1,30) PANEL FITTING EINBAUHINWEISE Fit the bezel to the front of the panel and then locate the meter into the bezel from behind. Alternatively the

DPM 2000

Abstract: 200S dpm2000 3.5 digit dpm dpm 116 dpm200
Contextual Info: DIMENSIONS ABMESSUNGEN All dimensions in mm inches Panel cut-out 68 x 33 (2.68 x 1.30) Alle Abmessungen in mm (Zoll) Einbauausschnitt 68 x 33 (2,68 x 1,30) PANEL FITTING EINBAUHINWEISE Fit the bezel to the front of the panel and then locate the meter into the bezel from behind. Alternatively the

DPM300

Abstract: DPM300S Lascar Electronics
Contextual Info: GB DIMENSIONS D All dimensions in mm inches Panel cut-out 68 x 33 (2.68 x 1.30) Alle Abmessungen in mm (Zoll) Einbauausschnitt 68 x 33 (2,68 x 1,30) PANEL FITTING EINBAUHINWEISE Fit the bezel to the front of the panel and then locate the meter into the bezel from behind. Alternatively the

MS-034

Contextual Info: PDF: 2002 May 07 Philips Semiconductors Package outline HBGA960: plastic thermal enhanced ball grid array package; 960 balls; body 33 x 33 x 2.4 mm; heatsink B D SOT683-1 A ball A1 index area A A2 E A1 detail X C e1 y y1 C ∅v M C A B b e ∅w M C AK AH AF

Contextual Info: M 52B 33/M 52B 33H E52B33/E52B33H 64K Electrically Erasable PROM October 1987 Features m 5 V ± 1 0 % V Cc m 1 ms 52B 33H or 9 ms (52B 33) TTL Byte Erase/Byte Write • Power Up/Down Protection m DiTrace ■ Fast Read Access Time—250 ns ■ Infinite Number of Read Cycles

L103B

Abstract: 6Z121 r302b 2SA179 D15105 HGR-30 BC45B Z-59 lz-173 Z436
Contextual Info: R9 1 1K A 33 0 33 0 R P2 0 10 5 V _C PU V _C PU ST P C LK # S LP # IN T R N MI A N3 1 A DS # R4 4 T DO T DI T MS T CK P ICD 1 P ICD 0 33 0 ST P C LK # S LP # IN T R N MI R P1 4 10 5 10P 8R -1 K R 1 2 3 4 6 7 8 9 A G3 5 A H3 0 M3 6 L3 7 AL3 3 A N3 7 A N3 5

Contextual Info: IBM25CPC710AB3A100 IBM Dual Bridge and Memory Controller Features • • • • • • • • • • • • • • Up to 100 MHz PowerPC 60x 64-bit bus Supports 100 MHz SDRAM including PC100 I/O for up to 2 MB 8-bit flash ROM 32-bit 33 MHz/64-bit 33-66 MHz async dual bus