Untitled
Abstract: No abstract text available
Text: TITLE: ENGINEERING CONTROL DRAWING. PART IDENTIFIER: CT2010ALN DESCRIPTION: HIGH POWER CHIP TERMINATION, ALUMINUM NITRIDE ASSEMBLY DWG: 1101534 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: DC - 4 GHZ. 1.1.3 VSWR: 1.25:1 MAX.
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CT2010ALN
MIL-STD-454,
IP-1014.
MC0023.
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Untitled
Abstract: No abstract text available
Text: TITLE: ENGINEERING CONTROL DRAWING. PART IDENTIFIER: CT2010ALNF DESCRIPTION: HIGH POWER CHIP TERMINATION, ALUMINUM NITRIDE LEAD FREE PLATING ASSEMBLY DWG: 1101654 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: DC - 4 GHZ.
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CT2010ALNF
MIL-STD-454,
IP-1014.
MC0023.
04-E094
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CT2010ALNF
Abstract: 1010135 MIL-STD-454 requirement 9
Text: TITLE: ENGINEERING CONTROL DRAWING. PART IDENTIFIER: CT2010ALNF DESCRIPTION: HIGH POWER CHIP TERMINATION, ALUMINUM NITRIDE LEAD FREE PLATING ASSEMBLY DWG: 1101654 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: DC - 4 GHZ.
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CT2010ALNF
MIL-STD-454,
824W154.
755W002.
09-E0833
CT2010ALNF
1010135
MIL-STD-454 requirement 9
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CT2010A
Abstract: 1010555 MIL-STD-454
Text: TITLE: ENGINEERING CONTROL DRAWING. PART IDENTIFIER: CT2010A DESCRIPTION: HIGH POWER CHIP TERMINATION, ALUMINA ASSEMBLY DWG: 2900144 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: DC - 2 GHZ. 1.1.3 VSWR: 1.35:1 MAX. 1.1.4
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CT2010A
MIL-STD-454,
824W154.
755W002.
08-E0615
CT2010A
1010555
MIL-STD-454
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Untitled
Abstract: No abstract text available
Text: TITLE: ENGINEERING CONTROL DRAWING. PART IDENTIFIER: CT2010AF DESCRIPTION: HIGH POWER CHIP TERMINATION, ALUMINA, LEAD FREE PLATING ASSEMBLY DWG: 2900154 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: DC - 2 GHZ. 1.1.3
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CT2010AF
MIL-STD-454,
IP-1014.
MC0023.
04-E282
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Untitled
Abstract: No abstract text available
Text: TITLE: ENGINEERING CONTROL DRAWING. PART IDENTIFIER: CT2010A DESCRIPTION: HIGH POWER CHIP TERMINATION, ALUMINA ASSEMBLY DWG: 2900144 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: DC - 2 GHZ. 1.1.3 VSWR: 1.35:1 MAX. 1.1.4
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CT2010A
MIL-STD-454,
IP-1014.
MC0023.
04-E217
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CT2010ALN
Abstract: 1009055 MIL-STD-454
Text: TITLE: ENGINEERING CONTROL DRAWING. PART IDENTIFIER: CT2010ALN DESCRIPTION: HIGH POWER CHIP TERMINATION, ALUMINUM NITRIDE ASSEMBLY DWG: 1101534 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: DC - 4 GHZ. 1.1.3 VSWR: 1.25:1 MAX.
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CT2010ALN
MIL-STD-454,
824W154.
755W002.
09-E0833
CT2010ALN
1009055
MIL-STD-454
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Termination10
Abstract: No abstract text available
Text: CT2010AB5C AlN Chip Termination 10 Watts CW Power: 50 Ω ± 5% Resistance: 1.25:1 VSWR: Frequency Range: DC to 4 GHz RoHS Compliant Substrate: AlN ? Typical Performance Return Loss -10 dB -20 -30 -40 -50 -60 0.5 1 1.5 2 2.5 3 3.5 4 Frequency (GHz) For detailed information regarding this product or sample request contact Johanson Sales
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CT2010AB5C
Termination10
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TF800BB14-061
Abstract: P1999 8051 microwave oven ec 9410 cf K 2676 9343-11R1 TF800BA14-061 2320-1SL 9816SL 9410-3SL-1
Text: < ] ^ _dZkijho$@e^Wdied^Wibed]X[[dh[Ye]d_p[ZWiW $ J^[jhWZ_j_edYedj_dk[i°
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JK-943L
9343-11R1
9343-12R1
9343-13R1
9343-14R1
9343-16R1
9343-18R1
JK-943H
TF800BB14-061
P1999
8051 microwave oven
ec 9410 cf
K 2676
9343-11R1
TF800BA14-061
2320-1SL
9816SL
9410-3SL-1
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tva0300n07
Abstract: mmic amplifier marking code N10 MTVA0300N05 PST-02-A-1 TVA0300N07W3 electronic passive components catalog SC-1016 MTVA0300 SMT2010TALN 42TVA
Text: EMC TECHNOLOGY Custom Engineered Solutions 8851 SW Old Kansas Ave. 772 286-9300 ISO 9001 & 14001 Certified M I C R OWAV E C O M P O N E N T S www.emct.com Resistive Products, Smart Loads , High Reliability Stuart, FL 34997 (800) 544-5594 Thermopads®, Equalizers,
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EIA 549 Class 130B transformer
Abstract: mcf 300.04 capacitor 225 35k 844 SMD av 1.40.00 mkt x2 .01uf NTC 20K honeywell 1000 rpm dc motor 12v 100watt BO 680Y clarostat POTENTIOMETER 73JA SMD MARKING CODE 503b 03028BR
Text: ND3% BASE1 XXXX0118-0396-1-P 396 TSQ: 3001 CMS: CMS-USM TS host OP: NN COMP: 20-07-11 Hour: 11:09 TS:TS date TS time CAPACITORS Find Datasheets Online CERAMIC CAPACITORS MULTILAYER CERAMIC CAPACITORS - 0.5pF TO 82,000pF 2 MULTILAYER CERAMIC CAPACITORS - 0.5pF TO 82,000pF CONT.
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000pF
000pF
0201ZD103KAT2A
0201ZC103KAT2A
0201YC101KAT2A
0201YC271KAT2A
0201YC471KAT2A
02013A1R0CAT2A
02013A4R7CAT2A
02013A100JAT2A
EIA 549 Class 130B transformer
mcf 300.04
capacitor 225 35k 844 SMD
av 1.40.00 mkt x2 .01uf
NTC 20K honeywell
1000 rpm dc motor 12v 100watt
BO 680Y
clarostat POTENTIOMETER 73JA
SMD MARKING CODE 503b
03028BR
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CT2525ALN
Abstract: CT3523 CT2010A
Text: Chips – Standard Terminations EMC’s high power chip terminations are optimized for RF performance. All EMC chips are designed to minimize the variability of capacitive reactance. Localized hot spots associated with trimming have been eliminated. Reduced
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CT2525
CT3518A*
CT2335ALN
CT2335
CT3523T*
CT3725ALN
CT3725TALN*
CT3725
CT3737ALN
CT3737
CT2525ALN
CT3523
CT2010A
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ina 124
Abstract: CT2525ALN "beryllium oxide" HR0500 ct2335 SMT3725ALN SC0066M
Text: SES 1 Index Tedmolo^ii L Product Index EM C P art Num ber Description Pow er Level W Substrate M aterial M ax VSWR M ax Frequency (G Hz) Page N um ber TVA Series Thermopads 2 Alum ina 1.30:1 6 GHz 12 M TVAXXXXN XX Thermopads 0.2 A lum ina 1.30:1 18 GHz
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42TVA
R0300
HR0500
TS0300
TS0300W
TS0400
TS0500
TS0500W1
TS0500W
TS0500WB1
ina 124
CT2525ALN
"beryllium oxide"
ct2335
SMT3725ALN
SC0066M
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CT2525ALN
Abstract: CT2010A
Text: f*TTTS Tedm ohm/ Term inations Chips - Standard EMC's high power chip terminations are optimized fo r RF performance. All EMC chips are designed to minimize the variability o f capacitive reactance. Localized hot spots associated with trimming have been eliminated. Reduced
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CT2525
CT3518A*
CT2335ALN
CT2335
CT3523T*
CT3725ALN
CT3725TALN*
CT3725
CT3737ALN
CT3737
CT2525ALN
CT2010A
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