HVQFN Search Results

HVQFN24

Abstract: HVQFN-24 sot616
Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HVQFN24 package SOT616-1 Hx Gx D P C 0.105 SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout

110621

Abstract: SOT617-3
Contextual Info: Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm D B SOT617-3 A terminal 1 index area A A1 E detail X C e1 e 9 16 L y1 C C A B C v w 1/2 e b y 17 8 e e2 Eh 1/2 e 24 1 terminal 1 index area

hvqfn32

Abstract: HVQFN-32 solder paste SOT617-3
Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HVQFN32 package SOT617-3 Hx Gx D P C 0.105 SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout

Contextual Info: SOT905-1 HVQFN24; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code 12NC ending 118 Rev. 1 — 19 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape QA Seal

Contextual Info: +9 4 1  SOT617-1 HVQFN32; Reel pack; SMD, 7"; standard product orientation Orderable part number ending, 115 or X Ordering code 12NC) ending 115 Rev. 1 — 16 May 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape QA Seal

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HVQFN56 package SOT684-1 Hx Gx D P C 0.105 SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout

Contextual Info: 4 1  +9 SOT619-1 HVQFN48; Reel dry pack, SMD, 13" Q1/T1 standard product orientation Orderable part number ending, 518 or Y Ordering code 12NC) ending 518 Rev. 1 — 21 October 2013 Packing information 1. Packing method %DUFRGHODEHO 'U\DJHQW %DJ (6'SULQW

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of HVQFN16 package SOT758-1 Hx Gx D P 0.025 0.025 C 0.105 SPx Hy SPy tot nSPx Gy SPy nSPy SLy By Ay SPx tot SLx Bx Ax solder land solder paste deposit solder land plus solder paste occupied area

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of HVQFN40 package SOT618-2 Hx Gx D P C 0.105 SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout

Contextual Info: 4 1  +9 SOT618-6 HVQFN40; Reel dry pack, SMD, 13" Q1/T1 standard product orientation Orderable part number ending, 518 or Y Ordering code 12NC) ending 518 Rev. 1 — 6 September 2013 Packing information 1. Packing method %DUFRGHODEHO 'U\DJHQW %DJ (6'SULQW

Contextual Info: HV QF N2 4 SOT616-3 HVQFN24; Reel pack; SMD, 13", Turned Q2/T3 Standard product orientation Orderable part number ending ,128 or HP Ordering code 12NC ending 128 Rev. 1 — 25 April 2013 Packing information 1. Packing method Printed plano box Barcode label

SA58670ABS

Abstract: SA58670A 741 IC data sheet IC 741 data sheet pdf of 741 ic portable dvd player schematic diagram of video 8 channel audio amplifier circuit diagram 1 W stereo amplifier class d power amplifier data sheet IC 741
Contextual Info: SA58670A 2.1 W/channel stereo class-D audio amplifier Rev. 02 — 23 October 2008 Product data sheet 1. General description The SA58670A is a stereo, filter-free class-D audio amplifier which is available in an HVQFN20 package with the exposed Die Attach Paddle DAP .

HVQFN32

Abstract: SOT617-3
Contextual Info: 4 1  SOT617-3 +9 HVQFN32; Reel pack, SMD, 13" Q1/T1 standard product orientation Orderable part number ending ,118 or J Ordering code 12NC) ending 118 Rev. 1 — 2 April 2014 Packing information 1. Packing method Printed plano box Barcode label Reel Tape

Contextual Info: Package outline HVQFN32R: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; resin based; body 7 x 7 x 0.8 mm B D SOT1152-1 A terminal 1 index area A E detail X e1 e ∅v ∅w b C A B C C 1/2 e L1 9 y y1 C 16 L 8 17 e Eh e2 1/2 e

Contextual Info: Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm SOT684-5 A D D1 B terminal 1 index area A E1 A4 c E A1 detail X C e1 1/2 e e 15 28 L y y1 C v M C A B w M C b 29 14 e e2 Eh 1/2 e 1

Contextual Info: Package outline HVQFN16: plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 3 x 3 x 0.85 mm B D SOT758-2 A terminal 1 index area E A A1 c detail X e1 1/2 e v w b e 5 8 M M C C A B C y1 C y L 9 4 e e2 Eh 1/2 e 1 12 16 terminal 1

HVQFN36

Contextual Info: Package outline HVQFN36: plastic thermal enhanced very thin quad flat package; no leads 36 terminals; body 6 x 6 x 0.85 mm SOT1092-1 B D D1 A terminal 1 index area E1 E A A4 A1 c detail X e1 e 10 18 C C A B C v w b y y1 C L 19 9 e e2 Eh 1 terminal 1 index area

Contextual Info: Package outline HVQFN36R: plastic thermal enhanced very thin quad flat package; no leads; 36 terminals; resin based; body 6 x 5 x 0.85 mm A B D SOT1000-1 terminal 1 index area E A detail X e1 v w M M C A B C L1 1/2 e e v w b 11 18 C C A B C M M y y1 C L 10

HVQFN36

Contextual Info: Package outline HVQFN36: plastic thermal enhanced very thin quad flat package; no leads; 36 terminals; body 6 x 6 x 0.85 mm A B D SOT1092-2 terminal 1 index area E A A1 c detail X e1 e 10 18 C C A B C v w b y1 C y L 19 9 e e2 Eh 1 27 terminal 1 index area

Contextual Info: Package outline HVQFN64: plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 x 9 x 0.85 mm A B D SOT804-3 terminal 1 index area E A A1 c detail X e1 1/2 e e L 17 32 C C A B C v w b y1 C y 33 16 e e2 Eh 1/2 e 1 terminal 1 index area

Contextual Info: Package outline HVQFN48: plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.9 mm D SOT619-5 A B terminal 1 index area E A A1 c detail X C e1 e 1/2 e v w b 13 24 L M M y y1 C C A B C 25 12 e e2 Eh 1/2 e 1 36 terminal 1

Contextual Info: SA58670 2.1 W/channel stereo class-D audio amplifier Rev. 03 — 11 June 2009 Product data sheet 1. General description The SA58670 is a stereo, filter-free class-D audio amplifier which is available in an HVQFN20 package with the exposed Die Attach Paddle DAP .

HVQFN48

Abstract: sot778
Contextual Info: PDF: 2002 Jul 05 Philips Semiconductors Package outline HVQFN48: plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 6 x 6 x 0.85 mm A B D SOT778-1 terminal 1 index area A E A1 c detail X C e1 e 1/2 e v M C A B w M C b 13 24

Contextual Info: SA58670A 2.1 W/channel stereo class-D audio amplifier Rev. 02 — 23 October 2008 Product data sheet 1. General description The SA58670A is a stereo, filter-free class-D audio amplifier which is available in an HVQFN20 package with the exposed Die Attach Paddle DAP .