IHPC Search Results

Contextual Info: ICs for Communications ISDN High Voltage Power Controller IHPC PEB 2026 Version 1.1 Data Sheet 09.99 DS 2 PEB 2026 Revision History: Current Version: 09.99 Previous Version: preliminary Data Sheet 02.96 Page in previous Version Page (in current Version)

smd KJD

Abstract: PEF2026 marking kjd PEB2026 ITB07375 ITD07385 ITP07376 ITP07377 ITS07379 ITS07386
Contextual Info: Infineon technologies ICs for Communications ISDN High Voltage Power Controller IHPC PEB 2026 Version 1.1 Data Sheet 09.99 DS 2 This Material Copyrighted By Its Respective Manufacturer PEB 2026 Revision History: Current Version: 09.99 Previous Version: preliminary Data Sheet 02.96

2010 smd resistor

Abstract: SMD capacitor package capacitor smd 106 ISDN High Voltage Power Controller IHPC SMD 106 CAPACITOR 2026T-P 2026T-S
Contextual Info: ISDN High Voltage Power Controller IHPC General Description The IHPC is an integrated power controller especially designed for feeding two-wire ISDN-transmission lines. One line can be powered by one IHPC. An external resistor defines the value of the current-limit for the line. Powering

TRANSISTOR C 2026

Abstract: GPS05094 GPS05791 P-DSO-20
Contextual Info: ICs for Communications ISDN High Voltage Power Controller IHPC PEB 2026 Version 1.1 Data Sheet 09.99 DS 2 • PEB 2026 Revision History: Current Version: 09.99 Previous Version: preliminary Data Sheet 02.96 Page in previous Version Page (in current Version)

pmb 4220

Abstract: Siemens pmb 4220 PMB 27251 4310 SMD IC 2197-T 82526-N smd 2035 DSP/pmb 4220 PMB27201 SICOFI PEF 2465
Contextual Info: Summary of Types in Alphanumerical Order Type Short Title Function Page PEB 2025-N IEPC ISDN Exchange Power Controller SMD 121 PEB 2025-P IEPC ISDN Exchange Power Controller 121 PEB 2026T-P IHPC ISDN High Voltage Power Controller (SMD) 106 PEB 2026T-S IHPC

P-DSO-20

Abstract: 2026T-P PEB2026 ITB07375 ISDN High Voltage Power Controller IHPC one line diagram 2026T-S
Contextual Info: ISDN High Voltage Power Controller IHPC PEB 2026 General Description The IHPC is an integrated power controller especially designed for feeding two-wire ISDN-transmission lines. One line can be powered by one IHPC. An external resistor defines the value of the current-limit for the line. Powering can

SIEMENS BST

Abstract: A712S siemens 230 96 SIEMENS BST P smd 42t MAS 10 RCD SIEMENS BST h 05 60 SIEMENS BST g 02 60 HPC16 SIEMENS BST N 35
Contextual Info: SIEM ENS 4M x 16-Bit Dynamic RAM HYB 3164165AT L -40/-50/-60 (8k, 4k & 2k-Refresh, EDO-version) HYB 3165165AT(L) -40/-50/-60 HYB 3166165AT(L) -40/-50/-60 P re lim in ary Info rm ation • 4 194 304 words by 16-bit organization • 0 to 70 ”C operating temperature

DTMF Tone Decoder

Abstract: TSOP32 pad DDS1703 MSM7570L-01 MSM7570L-02
Contextual Info: O K I Semiconductor M SM 7570L-01/02 Multi-Function ADPCM CODEC G E N E R A L DESCRIPTION The M SM 7570L-01 /0 2 , developed for advanced digital cordless telephone system s, are single channel A D PC M CO D EC ICs w hich perform m utual transcoding betw een the analog v oiceband

Contextual Info: IBM11N8845HB Preliminary 8M x 72 Super EOS Module Features • 168 Pin JEDEC Standard, Unbuffered 8 Byte Dual In-line Memory Module • 8Mx72 Extended Data Out Page Mode DIMMs • • Provides Chip-Kill ECC protection transparently to an existing Single Error Correction (SEC) system

Contextual Info: Electrical Characteristics 12.1 Signal Specifications 12.1.1 Unused Pins 12 For reliable operation, always connect unused inputs to an appropriate signal level. Unused A G TL+ inputs should be connected to V 7 7 . Unused active low 3.3 V-tolerant inputs should be

Orion 128GS24Y

Abstract: C4021 OGM-128GS24Y-1-C4021 128GS24 DATA VISION LCD MODULE lcd display orion
Contextual Info: CDODT SPEC. NO TSSI JET DATE CU STO M KR M 0 1) H: J, D E S C K IF I’ION : OG IVI - 1 2SGS2-1Y - 1 -O l ft/>1 LCD M ODULE I'HIS SPECIFICATION IS A l’PLIHD KOH LCD MODLLK. DKLIVHKKD II) Y ülJlt COMI'ANY HY Ol NUN DISPLAY [M JJ jUCtY CO., LTD ♦ CUSTOM KK APPROVAL

a19t

Abstract: A19t SOT-23
Contextual Info: 环境经营推进部 千叶县千叶市美浜区中濑 1-8 邮编 261-8507 电话：+81-43-211-1111（总机） +81-43-211-1149（直线） 传真：+81-43-211-8019 主页：http://www.sii.co.jp/eco/ 力求与社会共存 与地球环境和谐 精工电子集团

Contextual Info: IBM11D1365E IBM11D2365E 1M/2M x 36 DRAM Module Features 72-Pin Single-In-Line Memory Module Performance: -60 High Performance C M O S process Single 5V, ± 0.5V Power Supply All inputs & outputs are fully TTL & C M O S compatible Low active current dissipation

O-7620

Abstract: Nippon capacitors
Contextual Info: HB56UW1672EJN-A Series, HB56UW1664EJN-A Series 16777216-word x 72-bit High Density Dynamic RAM Module, 16777216-word x 64-bit High Density Dynamic RAM Module HITACHI ADE-203-819A Z Rev. 1.0 Sep. 5, 1997 Description The HB56UW1672EJN-A, HB56UW1664EJN-A belong to 8-byte DIMM (Dual in-line Memory Module)

TB 1226 BN

Abstract: 531 T70 n03 0AS001 B05AD 2U 34
Contextual Info: in y Intel 450NX PCIset 82454NX PCI Expander Bridge PXB 82453NX Data Path Multiplexor (MUX) 82452NX RAS/CAS Generator (RCG) 82451 NX Memory & I/O Controller (MIOC) Revision 1.3 March 1999 Intel Corporation 1998,1999 Information in this document is provided in connection with Intel products. No license, express or

trw 1014

Abstract: ibm dram
Contextual Info: IBM0118165 IBM0118165M IBM0118165B IBM0118165P 1M x 16 10/10 EDO DRAM Features • 1,048,576 wordby 16 bit organization • Low Power Dissipation - Active max - 130 mA /1 0 5 mA . Standby: TTL Inputs (max) - 1.0 mA " Standby: CMOS Inputs (max) - 1 0 mA (SP version)

Contextual Info: IB M 1 1 M 4 7 3 5 C IB M 1 1 M 4 7 3 5 C B 4M x 72 DRAM MODULE Features • 168 Pin JEDEC Standard, 8 Byte Dual In-line Memory Module • Optimized for ECC applications • System Performance Benefits: - • 4Mx72 Extended Data Out Page Mode DIMM • Performance:

HM5118165J6

Contextual Info: HM5118165 Series 1048576-word x 16-bit Dynamic RAM HITACHI ADE-203-636C Z Rev. 3.0 Feb. 24, 1997 Description The Hitachi HM5118165 is a CMOS dynamic RAM organized as 1,048,576-word x 16-bit. It employs the most advanced 0.5 |im CMOS technology for high performanceand low power. The HM5118165offers

K250 capacitor

Abstract: DNR2
Contextual Info: @ LG Semicon. Co. LTD. Features Description The GMM7322010ES/SG is a 2M x 32 bits D y n a m ic R A M M O D U L E w h ic h is assembled 16 pieces o f 1M x 4bit EDO DRAMs in 24 pin SOJ package on both sides the printed circuit board with decoupling capacitors. The G M M 7322010ES/SG is

MSC2343257A-XXDS8

Contextual Info: MSC2343257A-xxBS8/DS8 1995.12.20. OKI semiconductor MSC2343257A-XXBS8/DS8 4,194,304 Word x 32-Bit DYNAMIC RAM MODULE : FAST PAGE MODE WITH EDO G E N E R A L D ES C R IPTIO N The Oki MSC2343257A-xxBS8/DS8 is a fully decoded, 4,194,304 word x 32 bit CMOS dynamic random

d42s

Abstract: n010 marking
Contextual Info: DATA SHEET MOS INTEGRATED CIRCUIT juPD42S16405L, 4216405L 3.3 V OPERATION 16 M-BIT DYNAMIC RAM 4 M -W ORD BY 4-BIT, EDO Description The ,uPD42S16405L, 4216405L are 4,194,304 w ords by 4 bits CMOS dynam ic RAM with optional EDO. EDO is a kind of the page mode and is useful for the read operation.

VT1634AL

Abstract: tf041-th-pcb via vt1634al PCT303W PCT303A ad7 l59 16pin soic MITAC schematic 39-XI amilo schematic W83L950
Contextual Info: SERVICE MANUAL FOR 8650 BY: Sanny.Gao Repair Technology Research Department /EDVD November. 2005/R01 8650 N/B Maintenance Contents 1. Hardware Engineering Specification …………………………………………………………………. 4 1.1 Introduction …………………………………………………………………………………………………………… 4

CP2211

Abstract: VT1634 ac14g mitac 8 W83L950 LM358 K8N800 h55 MOTHERBOARD CIRCUIT diagram ICS952007 cb-1410
Contextual Info: SERVICE MANUAL FOR 8889 BY: Star Meng Repair Technology Research Department /EDVD Nov.2004 8889 N/B Maintenance Contents 1. Hardware Engineering Specification ……………………………………………………………………… 4 1.1 Introduction ………………………………………………………………………………………………………………. 4

intel chipset g31 motherboard repair

Abstract: l7251 mitac 8666 diode 25PH 800 PN800 intel g31 motherboard repair g31 motherboard repair CGR18650C PC709 VIA vt8237
Contextual Info: SERVICE MANUAL FOR 8666 BY: Star Meng Repair Technology Research Department /EDVD Apr.2005 / R01 8666 N/B Maintenance Contents 1. Hardware Engineering Specification ……………………………………………………………………… 4 1.1 Introduction ………………………………………………………………………………………………………………. 4