LATTICE SEMICONDUCTOR TAPE AND REEL Search Results

US mark

Contextual Info: Tape and Reel Specifications A tape-and-reel packing container is available for plastic leaded chip carriers to protect the product from mechanical/ electrical damage and to provide an efficient method for handling. Lattice Semiconductor’s tape-and-reel

Lattice PLSI

Abstract: lattice semiconductor tape and reel
Contextual Info: Tape and Reel Specifications cover tape seals the carrier tape and holds the devices in the pockets. A full reel holds a maximum quantity of devices depending on the package size. Lattice Semiconductor requires ordering in full reel quantities. Once loaded, the tape is wound onto a plastic reel for

16-mm

Abstract: 16MM TAPE PACKAGE
Contextual Info: Tape and Reel Specifications cover tape seals the carrier tape and holds the devices in the pockets. A full reel holds a maximum quantity of devices depending on the package size. Lattice Semiconductor requires ordering in full reel quantities. Once loaded, the tape is wound onto a plastic reel for

LATTICE SEMICONDUCTOR Tape and Reel Specification

Contextual Info: Tape and Reel Specifications cover tape seals the carrier tape and holds the devices in the pockets. Once loaded, the tape is wound onto a plastic reel for labeling and packing. A full reel holds a maximum quantity of devices depending on the package size. Lattice Semiconductor requires ordering in full reel

REELS

Abstract: CABGA 56
Contextual Info: Product Bulletin November 2010 #PB1240I Lattice Ordering Guidelines for Custom Product and Tape and Reel Introduction Lattice “Custom Products” include the following: • Factory Pre-Programming Encryption & Non-Encryption  Custom Processing (Including custom testing, restricted material set, custom product

TQFP Shipping Trays

Abstract: LATTICE plsi 3000 PB1084 lattice semiconductor tape and reel
Contextual Info: Product Bulletin June, 1998 Updated #PB1084 Lattice Pre-Patterned and Tape and Reel Ordering Guidelines Introduction After reviewing customer ordering patterns and costs associated with providing prepatterned and/or tape and reel PLDs, Lattice has modified its minimum ordering quantity

416-ball

Abstract: 1152-ball 132-ball lattice fpbga 484 FPBGA
Contextual Info: Product Bulletin April 2009 #PB1240H Lattice Ordering Guidelines for Custom Product and Tape and Reel Introduction Lattice “Custom Products” include the following: • Factory Programming • Custom Processing • Custom Testing • Custom Marking •

MACH211-15JC

Abstract: mach210-15jc Mach445-15yc GAL20V8C-10LJ GAL22V10D-15LS GAL16V8D-25LP GAL16V8D GAL16V8D 15LP datasheet PALCE16V8H-10JC/4 MACH210-12JC
Contextual Info: Page 1 October 5, 2001 Subject: PCN# 010A-01 Notification of Obsolescence of Devices Fabricated in AMD Fab 14 Dear Lattice Customer, Lattice is providing this notification of the obsolescence of those programmable logic devices fabricated in Advanced Micro Device’s AMD’s Fab 14.

Contextual Info: iCE40LM Family Data Sheet DS1045 Version 1.2, March 2014 iCE40LM Family Data Sheet Introduction January 2014 Data Sheet DS1045 General Description iCE40LM family is an ultra-low power FPGA and sensor manager designed for ultra-low power mobile applications, such as

Contextual Info: iCE40LM Family Data Sheet DS1045 Version 1.3, March 2014 iCE40LM Family Data Sheet Introduction January 2014 Data Sheet DS1045 General Description iCE40LM family is an ultra-low power FPGA and sensor manager designed for ultra-low power mobile applications, such as

LATTICE SEMICONDUCTOR Tape and Reel Specification

Contextual Info: iCE40LM Family Data Sheet DS1045 Version 1.4, August 2014 iCE40LM Family Data Sheet Introduction January 2014 Data Sheet DS1045 General Description iCE40LM family is an ultra-low power FPGA and sensor manager designed for ultra-low power mobile applications, such as

LCMXO2-256 pinout

Contextual Info: MachXO2 Family Data Sheet Preliminary DS1035 Version 01.2, April 2011 MachXO2 Family Data Sheet Introduction April 2011 Features Preliminary Data Sheet DS1035  Flexible On-Chip Clocking • Eight primary clocks • Up to two edge clocks for high-speed I/O 

LCMX02

Abstract: LCMX02 1200 LCMXO2-1200HC-4TG144C LCMXO2-4000HC LCMXO2-1200HC-4MG132C lcmxo2-1200 TQFP-144 footprint LCMXO2-7000HC LCMXO2-640HC-4TG100C LCMX02-2000
Contextual Info: MachXO2 Family Data Sheet Preliminary DS1035 Version 01.5, August 2011 MachXO2 Family Data Sheet Introduction April 2011 Features Preliminary Data Sheet DS1035  Flexible On-Chip Clocking • Eight primary clocks • Up to two edge clocks for high-speed I/O 

Contextual Info: MachXO2 Family Data Sheet Preliminary DS1035 Version 01.5, August 2011 MachXO2 Family Data Sheet Introduction April 2011 Features Preliminary Data Sheet DS1035  Flexible On-Chip Clocking • Eight primary clocks • Up to two edge clocks for high-speed I/O 

LCMX02

Abstract: LCMXO2-4000 LCMX02 1200 LCMX02-2000 LCMXO2-7000HC-4TG144 HB1010 LCMXO2-1200HC-4MG132C LCMXO2 verilog HDL program to generate PWM XO2-640
Contextual Info: MachXO2 Family Handbook HB1010 Version 01.9, September 2011 MachXO2 Family Handbook Table of Contents September 2011 Section I. MachXO2 Family Data Sheet Introduction Features . 1-1

Contextual Info: iCE40 LP/HX Family Data Sheet DS1040 Version 02.8, February 2014 iCE40 LP/HX Family Data Sheet Introduction February 2014 Data Sheet DS1040 Features – Schmitt trigger inputs, to 200 mV typical hysteresis • Programmable pull-up mode  Flexible Logic Architecture

Contextual Info: iCE40 LP/HX Family Data Sheet DS1040 Version 02.5, August 2013 iCE40 LP/HX Family Data Sheet Introduction August 2013 Data Sheet DS1040  Flexible On-Chip Clocking Features • Eight low-skew global clock resources • Up to two analog PLLs per device

Contextual Info: iCE40 LP/HX Family Data Sheet DS1040 Version 02.4, July 2013 iCE40 LP/HX Family Data Sheet Introduction July 2013 Data Sheet DS1040  Flexible On-Chip Clocking Features • Eight low-skew global clock resources • Up to two analog PLLs per device  Flexible Logic Architecture

LATTICE SEMICONDUCTOR Tape and Reel Specification

Abstract: LVDS25E 0.4mm pitch BGA routing ICE40 FPGA pitch 0.4mm BGA 0.4mm pitch 2.5x2.5mm
Contextual Info: iCE40 LP/HX Family Data Sheet DS1040 Version 02.3, May 2013 iCE40 LP/HX Family Data Sheet Introduction April 2013 Data Sheet DS1040  Flexible On-Chip Clocking Features • Eight low-skew global clock resources • Up to two analog PLLs per device  Flexible Logic Architecture

Contextual Info: iCE40 LP/HX Family Data Sheet DS1040 Version 02.6, September 2013 iCE40 LP/HX Family Data Sheet Introduction August 2013 Data Sheet DS1040  Flexible On-Chip Clocking Features • Eight low-skew global clock resources • Up to two analog PLLs per device

ICE40 lattice

Abstract: ICE40 FPGA 0.4mm pitch BGA routing TN1251 ICE40LP1K ICE40LP1K-CM36 GDDR71 pitch 0.4mm BGA 0.4mm pitch 2.5x2.5mm ICE40LP384SG32
Contextual Info: iCE40 LP/HX Family Data Sheet DS1040 Version 02.2, April 2013 iCE40 LP/HX Family Data Sheet Introduction April 2013 Data Sheet DS1040  Flexible On-Chip Clocking Features • Eight low-skew global clock resources • Up to two analog PLLs per device  Flexible Logic Architecture

Contextual Info: iCE40 LP/HX Family Data Sheet DS1040 Version 02.9, April 2014 iCE40 LP/HX Family Data Sheet Introduction February 2014 Data Sheet DS1040 Features  Flexible Logic Architecture – Schmitt trigger inputs, to 200 mV typical hysteresis • Programmable pull-up mode

DS1047

Contextual Info: MachXO3L Family Data Sheet Advance DS1047 Version 00.2, February 2014 MachXO3L Family Data Sheet Introduction February 2014 Advance Data Sheet DS1047 Features  Solutions • • • • • • • • • • Smallest footprint, lowest power, high data

Contextual Info: iCE40 LP/HX Family Data Sheet DS1040 Version 3.0, July 2014 iCE40 LP/HX Family Data Sheet Introduction February 2014 Data Sheet DS1040 Features  Flexible Logic Architecture – Schmitt trigger inputs, to 200 mV typical hysteresis • Programmable pull-up mode