PAC PIN DIAGRAM Search Results

Contextual Info: DENSE-PAC Programmable Logic DPL22V10A MICROSYSTEMS DESCRIPTION: The Dense-Pac Programmable Logic Module DPL is a 48-pin Pin Grid Array (PGA) designed to support two "22V10" field programmable array logic, 22 input, 10 macrocell output devices (DPL22V10A), including decoupling capacitors, at a

DPV12832V

Abstract: 4-00J1 Dense-Pac Microsystems
Contextual Info: DENSE-PAC MICR OSY STEMS 2ÔE D • £75=1415 OOQQIBb ? «] >PC DPV12832V Dense-Pac Microsystems, Inc. ^ 128K X 32 UVEPROM VERSAPAC X 4 ¿ ,- / 3 '2 9 DESCRIPTION: The DPV12832V is a 66-pin Pin Grid Array PGA consisting of four 128K X 8 UVEPROM devices in

Contextual Info: 128 Megabit CMOS DDR SDRAM DPDD32MX4RSAY5 PRELIMINARY PIN-OUT DIAGRAM DESCRIPTION: The is a Dense-Pac core technology used to create 3-Dimensional solid state memory arrays. The DPDD32MX4RSAY5 is a member of the LP-Stack family which applies the Dense-Pac technology to create a 128Mb

Contextual Info: v DENSE-PAC 4 Programmable Logic M I C R O S Y S T E M S \ D P L 2 2 V 1 OA DESCRIPTION: The Dense-Pac Programmable Logic M odule DPL is a 48-pin

Contextual Info: 128 Megabit CMOS DDR SDRAM DPDD32MX4RSAY5 PRELIMINARY PIN-OUT DIAGRAM DESCRIPTION: The is a Dense-Pac core technology used to create 3-Dimensional solid state memory arrays. The DPDD32MX4RSAY5 is a member of the LP-Stack family which applies the Dense-Pac technology to create a 128Mb

40-pin EPROM pinout

Contextual Info: DENSE-PAC MICROSYSTEMS CDPM 2ÔE D Dense-Pac Microsystems, Inc. • 575^415 OGOQ^Sa 5 WËVPC DPV128X16A ^ H IG H SPEED 128K X 16 U V EP R O M PG A M O D U LE PRELIMINARY DESCRIPTIO N: The DPV128X16A is a 40-pin Pin Grid Array PGA consisting of two 128K X 8 UVEPRO M devices in

Contextual Info: Advance Data Sheet April 1998 microelectronics group Lucent Technologies Bell Labs Innovations A370-Type Analog Uncooled Flat-PAC Laser Module Features • Eight-pin flat-PAC package suitable for CATV applications ■ Frequency range up to 1.5 GHz ■ MQW F-P 1.3 fim laser with single-mode fiber

20-PAD

Abstract: 26LS32 pin diagram
Contextual Info: DENSE-PAC LOGIC MODULE MICROSYSTEMS 36-PIN PGA LOGIC DESCRIPTION: The Dense-Pac LO G IC M O DULE consists of two logic devices in standard JEDEC 20-pad ceramic LCC Leadless Chip Carrier packages, surface-mounted on a co-fired ceramic substrate. The 36 pins of the LOGIC M ODULE are

26LS32 pin diagram

Contextual Info: DENSE-PAC LOGIPAC M O D U LE 40-PIN PGA LOGIC MODULE M I C R O S Y S T E M S DESCRIPTION: The second Dense-Pac Logic module, the LOGIPAC consists of two logic devices in standard JED EC 20 pad ceramic LCC Leadless Chip Carrier packages, surface-mounted on a co-fired

Contextual Info: _ ' / f ' _ DENSE-PAC 0.5 Megabit UVEPROM D P V3 2 X 16A MICROSYSTEMS DESCRIPTION: The DPV32X16A is a 40-pin Pin Grid Array PGA consisting of two 32K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired

Contextual Info: DENSE-PAC 8 Megabit UVEPROM MICROSYSTEMS DPV256X32V DESCRIPTION: The DPV256X32V is a 66-pin Pin Grid Array PGA consisting of four 256K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate w ith matched thermal coefficients.

Contextual Info: DENSE-PAC MICROSYSTEMS 8 Megabit U VEPROM DPV256X32V DESCRIPTION: The DPV256X32V is a 66-pin Pin Grid Array PGA consisting of four 256K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.

Contextual Info: DENSE-PAC MICROSYSTEMS 8 Megabit UVEPROM DPV256X32V DESCRIPTION: The DPV256X32V is a 66-pin Pin Grid Array PGA consisting of four 256K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate w ith matched thermal coefficients.

12 SQ 045 JF

Contextual Info: DENSE-PAC MICROSYSTEMS 1 Megabit UVEPROM DPV3232VA DESCRIPTION; The DPV3232VA is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.

Contextual Info: DENSE-PAC MICROSYSTEMS 256 Megabyte SDRAM D IM M DPSD32ML64RW5 PIN-OUT DIAGRAM I— DESCRIPTION: The JEDEC compatible DPSD32ML64RW5 is a high speed 256 Megabyte CMOS Synchronous DRAM DIMM, consisting of thirty-two 2Mx8x4 SDRAM devices configured as 16 stacked

Contextual Info: DENSE-PAC 1 Megabit UVEPROM M ICROSYSTEM S DPV3232VA DESCRIPTION; The DPV3232VA is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.

Contextual Info: DENSE-PAC 2 Megabit UVEPROM MICROSYSTEMS DPV128X16A DESCRIPTION: The D P V 128X 16A is a 40-pin Pin Grid Array PGA consisting of two 128K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.

Contextual Info: DENSE-PAC 4 Megabit CMOS UVEPROM MICROSYSTEMS DPV12832VA DESCRIPTION: The DPV12832VA is a 66-pin Pin Grid Array PGA consisting o f four 128K X 8 CMOS UVEPROM devices in ceram ic LCC packages surface mounted on a co-fired ceram ic substrate w ith matched thermal

0-32k

Abstract: CERAMIC PIN GRID ARRAY 120 pins 6A14
Contextual Info: £ n jS ¡^ DPV32X16A Dense-Pac Microsystems, Inc. 0 _ 32K X 16 UVEPROM PGA MODULE PRELIMINARY DESCRIPTION: The DPV32X16A is a 40-pin Pin Grid Array PGA consisting of two 32K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired

Contextual Info: DENSE-PAC 1 Megabit CMOS SRAM MICROSYSTEMS DPS3232V DESCRIPTION: The DPS3232V is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matchi ng thermal coeffi cients. The LCCs

Contextual Info: 128 Megabit C M O S D D R SDRAM DPDD16MX8RLBY5 DPDD16MX8RSBY5 DENSE-PAC MICROSYSTEMS ADVANCED INFORMATION DESCRIPTION: PIN-OUT DIAGRAM The PL-Sack series is a family of interchangeable memory devices The 128 Megabit Double Data Rate Synchronous D RAM isa member

Contextual Info: DENSE-PAC MICROSYSTEMS 8 Megabit CMOS UVEPROM DPV256S32W DESCRIPTION: PIN-OUT DIAGRAM The DPV256S32W is a 256K x 32 high-speed CMOS UVEPROM module comprised of eight 128K x 8 monolithic CMOS UVEPROM's, an advanced high-speed CM OS decoder, resistor network and

DENSE-PAC

Abstract: SO-DIMM 144-pin
Contextual Info: 16Mx64, 66MHz, SODIMM 30A185-00 C 128 Megabyte SDRAM SODIMM DPSD16MX64RSW5 DESCRIPTION: PIN-OUT DIAGRAM The JEDEC compatible DPSD16MX64RSW5 is a high speed 128 Megabyte CMOS Synchronous DRAM Small Outline DIMM utilizing Dense-Pac’s new and innovative 3-D space saving

Contextual Info: DENSE-PAC 16 Megabit CM OS SRAM MICROSYSTEMS DPS512X32ML/DPS512X32MW PRELIMINARY DESCRIPTION: PIN-OUT DIAGRAM The DPS512X32ML/DPS512X32MW is a 512K x 32 high density, high-speed Static Random Access Memory SRAM module, intended for high performance computers and digital signal processing