SICR RESISTOR Search Results

SiCr thin film

Abstract: SiCr resistor
Contextual Info: AT C W I R E B O N D A B L E R E S I S T I V E P R O D U C T S ATC WBR1 Series Wire Bond Resistors Top Contact/Bottom Isolated Features: • Resistance Range: 2.5 KΩ to 250KΩ* • Outline Size: 20 x 20 mils (0.51 x 0.51 mm) • Passivated SiCr Resistor Material

Wire Bond Resistors

Abstract: Resistors Terminations atceramics
Contextual Info: AT C W I R E B O N D A B L E R E S I S T I V E P R O D U C T S ATC WBR1 Series Wire Bond Resistors Top Contact/Bottom Isolated Features: • Resistance Range: 2 KΩ to 330 KΩ* • Outline Size: 20 x 20 mils (0.51 x 0.51 mm) • Passivated SiCr Resistor Material

Contextual Info: THIN FILM RESISTORS MSTF 35 WIRE BONDABLE MECHANICAL DA TA DAT 0.035" SIZE SUBSTRA TE SUBSTRATE RESISTOR BOND PADS BOND PAD SIZE BACKSIDE SURFACE 0.035" x 0.035" x 0.010" ±0.003" 99.6% ALUMINA, QUARTZ, GLASS (BeO OR AlN AVAILABLE) NICHROME, TTANT ANT ALUM NITRIDE, SICHROME

Contextual Info: THIN FILM RESISTORS MSTF 35 WIRE BONDABLE MECHANICAL DA TA DAT SIZE SUBSTRA TE SUBSTRATE RESISTOR BOND PADS BOND PAD SIZE BACKSIDE SURFACE 0.035" x 0.035" x 0.010" ±0.003" 99.6% ALUMINA, QUARTZ, GLASS (BeO OR AlN AVAILABLE) NICHROME, TTANT ANT ALUM NITRIDE, SICHROME

Contextual Info: THIN FILM RESISTORS MSTF 35 WIRE BONDABLE MECHANICAL DA TA DAT SIZE SUBSTRA TE SUBSTRATE RESISTOR BOND PADS BOND PAD SIZE BACKSIDE SURFACE 0.035" x 0.035" x 0.010" ±0.003" 99.6% ALUMINA, QUARTZ, GLASS (BeO OR AlN AVAILABLE) NICHROME, TTANT ANT ALUM NITRIDE, SICHROME

TCR500

Abstract: SiCr wire bond 60k4
Contextual Info: PMC Passive Micro Components OVERVIEW PMC thin-film technology offers comprehensive materials and processes combinations allowing electronic designers superior space saving, tolerance and signal integrity for semi custom designs in the MHz to GHz spectrum.

ids 2560

Abstract: SiCr 30X30 SiCr resistor
Contextual Info: Submicron Fab: 71 Vista Montana • San Jose, CA 95134 TEL: 408 222-8888 • FAX: (408) 222-2707 Wafer Foundry Services 3.0µm P-Well CMOS Process Standard Features ❖ ❖ ❖ ❖ Standard Layout Rules and Process Parameters UTIX Stepper Single or double poly

polysilicon

Abstract: Thin Film Resistors SiCr Thin Film Resistors SiCr analog
Contextual Info: Low TCR Precision Polysilicon Resistors  February 1996 Description Features • • • • • • • TCR less than 100 ppm/°C, -40 to +85°C . Target sheet resistance between 250 and 500Ω/sq. (depending on process used). Contact resistance typically less than

polysilicon

Abstract: Thin Film Resistors SiCr analog polysilicon resistor Thin Film Resistors SiCr
Contextual Info: Low TCR Precision Polysilicon Resistors  June 1995 Description Features • TCR less than 100 ppm/°C, -40 to +85°C . • Target sheet resistance between 300 and 500Ω/sq. (depending on process used). • Contact resistance typically less than 100Ω (for

ieee electrical engineering projects

Abstract: ieee electrical and electronics engineering projects AEC-Q100 "wireless design guide" maxim
Contextual Info: Put the Power of Maxim Behind You Benefit from over 18 years of ASIC expertise and a rich IP catalog Propel your design to success with Maxim’s comprehensive ASIC and foundry services. Our talented engineering staff will work side by side with you to transform your initial product specifications into a production-ready device. With hundreds of man-years

30X30

Abstract: SiCr resistor
Contextual Info: Submicron Fab: 71 Vista Montana • San Jose, CA 95134 TEL: 408 222-8888 • FAX: (408) 222-2707 Wafer Foundry Services 3.0µm N-Well CMOS Process Standard Features ❖ ❖ ❖ ❖ Standard Layout Rules and Process Parameters UTIX Stepper Single or double poly

Thin Film Resistors SiCr

Abstract: mini-systems
Contextual Info: Mini-Systems Thin Film Division PERFORMANCE www.Mini-SystemsInc.com CHIP RESISTORS _ Silicon, Alumina, BeO, Quartz, Glass, Aluminum Nitride Substrates Absolute T.C.R.’s to ±2ppm Resistance range from 0.050 Ω 50m Ω to 300M Ω Knowledgeable service, sales, and engineering support

monolithic circuit layout

Abstract: schottky transistor spice
Contextual Info: C ir\A v « /• H W V ^ Corporation ▼ SIGN AL PROCESSING EXCELLENCE ASIC Custom Monolithic Capabilities CUSTOM MONOLITHICS General Information Sipex designs and manufactures full custom analog circuits. Both dielectric isolation and foundry technologies are utilized to meet the

Contextual Info: DAC-8565 D/A Converters DAC-8565 Complete High Speed 12-Bit Monolithic D/A Converter This resistor geometry ensures near perfect nonlinearity after trim, and this geometry also reduces damage due to laser trimming. • The internal reference is laser trimmed to 10

Thin Film Resistors SiCr

Abstract: SiCr thin film TI SAC305 hfss 80Au-20Sn 3 to 10 GHz bandpass filter sac305 thermal conductivity 184394 ansoft SAC305 reflow bga
Contextual Info: AT C / / A V X T H I N F I L M TECHNOLOGIES Engineered Thin Film Solutions TA B L E O F C O N T E N T S Introduction to ATC // AVX Thin Film Technologies .1 - 2

SiCr

Abstract: SMD 100 6n cap ceramic pin grid array package wire bond AVX 9151 high current pogo pin 400nF 300V avx 0201 CX-101F CX-2520SB KT21
Contextual Info: IMAGINATION. CREATION. INNOVATION. AVX RF/Microwave Short Form RF Microwave Products Application Guide APPLICATIONS PRODUCTS System Frequency High Directivity Couplers 0402, 0603 Couplers (0603, 0805) 3dB Couplers KNA Filter Low Pass Filter 0805 Low Pass Filter 0603

DAC IC 1408

Abstract: specifications of ic 1408 specifications of DAC 1408 pin diagram of IC 1408 1408 dac internal circuit of ic 1408 AD559KD/BIN AD559 SiCr thin film AD559KD
Contextual Info: ANALOG DEVICES 8 Bit Monolithic D/A Converter FEATURES Replaces the M o torola 1 4 0 8 /1 5 0 8 8-Bit DAC Guaranteed M o n o to n icity and Relative Accuracy Over Full Tem perature Range Single Chip M o n o lith ic Construction Herm etic 16 Pin Ceramic D IP

SP 5001 IC INVERTER

Abstract: 555timer schmitt trigger using ic 555 ames 5 op-amp 4136 555timer ic SP 5001 inverter D flip-flop to T Flipflop circuit converter L 296 SP 5001 IC
Contextual Info: ELECTRONIC TECHNOLOGY 2=îE D □ 355G5flb 0QGG141» Q Q E L T C AD20S1 Series CMOS Semicustom Arrays High Output Mixed-mode CMOS 5-Mlcron Sl-gate CMOS Arrays • Analog functions Including Op-amps, voltage references, comparators, oscillators, and analog switches

Contextual Info: HVRD www.vishay.com Vishay Electro-Films High Voltage Thin Film Resistor Divider Network FEATURES • High precision thin film construction • Case size: 1206 • 120 V max. operating voltage • SMT assembly with edge castellation allowing visual inspection of solder joints

R68561

Abstract: R68560AP R68560/R68561 R68560
Contextual Info: BROOKTREE b3E CORP D • 1 1, 4 53 =1 5 0007507 IB ? «BR K R68560A • R68561A R68560A, R68561A Multi-Protocol Communications Controller MPCC DESCRIPTION FEATURES The R68560A, R68561A Multi-Protocol C om m unications Con­ troller (MPCC) interfaces a single serial com m unications chan­

Contextual Info: RAYTHEON/ SEMICONDUCTOR 11E D | 75^731,0 QQDt.aH 0 | Linear Custom 1C Design Services and Manufacturing _ Thin-Film Sputtering Options Foundation Processes Ion Implant and Metal Options JFET Transistors Thin-Film Resistors

map sensor

Abstract: common rail injector driver application ford ka ecu common rail injector test J1346 ford ecu automotive injector op amp for capacitive sensor pcb water level sensor abstract of ic fabrication
Contextual Info: MOTOROLA SEMICONDUCTOR APPLICATION NOTE AN1620 A Monolithic Integrated Solution for MAP Applications Prepared by: Rajan Verma, Ira Baskett, Mahesh Shah, Theresa Maudie, Dragan Mladenovic, and K. Sooriakumar Motorola Sensor Products Division 5005 East McDowell Road, MD Z210

Contextual Info: C ir > A Y U IU W Ä SP2101 Analog Array ^ Corporation ▼ SIGNAL PROCESSING EXCELLENCE Description The SP2101 is a high-density, high performance analog array containing 180 linear bipolar transistors. Twelve high current transistors capable of driving up

Contextual Info: C ir \Q v U IIJW V ^ SP2107 Analog Array Corpofation ▼ SIGNAL PROCESSING EXCELLENCE • ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ Dielectric Isolation Dl for Minimum Parasitics and Optimum Latch-up Free Performance 35 Volt or 20 Volt Process 20 Tile Array Structure