MT4C4001
Abstract: mt4c4001jdc sm03b
Text: MICRON TECHNOLOGY INC 55E D WÊ blllSHT ITT H I URN M T4C4001J DIE 1 MEG x 4 DRAM fAICRQN MILITARY DRAM DIE 1 MEG x 4 DRAM DIE FEATURES DIE OUTLINE Top View 14 13 12 11 10 15 5 4 3 2 □ □ □ □ □ □□□ □ □ □ □□□ □ DIE DATA BASE D15B
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T4C4001J
450mW
024-cycle
MT4C4001
mt4c4001jdc
sm03b
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T4C4001JDJ-6
Abstract: mt4c4001
Text: MT4C4001 J S 1 MEG X 4 DRAM [M IC R O N DRAM 1 MEG X 4 DRAM FEATURES • 1,024-cycle refresh distributed across 16ms (T4C4001J) or 128ms (M T4C4001J S) • Industry-standard pinout, timing, functions and packages • High-perform ance CM O S silicon-gate process
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MT4C4001
024-cycle
MT4C4001J)
128ms
T4C4001J
MT4C4001J
225mW
20/26-Pin
20-Pin
T4C4001JDJ-6
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Untitled
Abstract: No abstract text available
Text: M T 4 C 4 0 0 1 J S 1 MEG x 4 DRAM |U|(=RON DRAM 1 MEG x 4 DRAM 5V, STANDARD OR SELF REFRESH FEATURES • 1,024-cycle refresh distributed across 16ms (M T4C4001J) or 128ms (M T4C4001J S) • Industry-standard pinout, timing, functions and packages • High-perform ance CM OS silicon-gate process
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024-cycle
T4C4001J)
128ms
T4C4001J
MT4C4001J
20/26-Pin
MT4C4001
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Untitled
Abstract: No abstract text available
Text: 1, 2 MEG X 32 DRAM SIMMs MICRON • ItCHtfULOGYIMC D R A M L ^ r iA A lV I MT8D132 X MT16D232(X) MODULE FEATURES PIN ASSIGNMENT (Front View) • JEDEC- and industry-standard pinout in a 72-pin, single in-line m emory module (SIMM) • 4M B (1 M eg x 32) and 8MB (2 M eg x 32)
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MT8D132
MT16D232
72-pin,
024-cycle
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T4C4001JDJ-6
Abstract: T4C4001
Text: DRAM 1 MEG X 4 DRAM LOW POWER, EXTENDED REFRESH FEATURES • Industry standard x4 pinout, tim ing, functions and packages • High-performance, CM OS silicon-gate process • Single +5V ±10% power supply • All inputs, outputs and clocks are fully TTL compatible
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T4C4001J
024-cycle
128ms
225mW
20-Pin
MT4C4001JL
T4C4001JDJ-6
T4C4001
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MT4C4001
Abstract: No abstract text available
Text: MT20D240 2 MEG X 40 DRAM M ODULE p iC R O fS J 2 MEG X 40 DRAM DRAM MODULE NEW I FAST PAGE MODE MT20D240 LOW POWER, EXTENDED REFRESH (MT20D240 L) FEATURES • • • • PIN ASSIGNMENT (Top View) 72-pin single-in-line package High-performance CM OS silicon-gate process.
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MT20D240
72-pin
024-cycle
128ms
MT20D240)
MT4C4001
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MT4C4007JDJ
Abstract: ST bsx 26
Text: MTHat3Z XI(SFr MTt6D222(XJ (S | t M B G *ZM EE jc3ZDRÄIW1 M O D ULE DRAM 1 MEG, 2 MEG x 32 M UW D U L tr - 4, 8 MEGABYTE, 5V, OPTIONAL SELF REFRESH, FAST PAGE OR EDO PAGE MOPE FEATURES • JE D E C - a n d i n d u s tr y - s ta n d a r d pinout in a 72-pin,
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MTt6D222
72-pin,
23ZIX
MT4C4007JDJ
ST bsx 26
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Untitled
Abstract: No abstract text available
Text: MICR ON S E M I C O N D U C T O R INC b3E D • b l l l S M T D D D V bb ? 51b ■ MRN MT4C4004J 1 MEG x 4 DRAM I^HCRON DRAM 1 MEG x 4 DRAM QUAD CAS PARITY, FAST-PAGE-MODE FEATURES _ PIN ASSIGNMENT Top View • Four independent CAS controls, allowing individual
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MT4C4004J
36bit
275mW
A1993,
T4C4001JDJ
T4C4004JDJ
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Untitled
Abstract: No abstract text available
Text: MT4C4004J 1 MEG X 4 DRAM |U|IC=RON DRAM 1 MEG x 4 DRAM FEATURES _ • Four independent CAS controls, allowing individual manipulation to each of the four data input/output ports DQ1 through DQ4 . • Offers a single chip solution to byte level parity for 36bit words when using 1 Meg x 4 DRAMs for memory
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MT4C4004J
36bit
275mW
024-cycle
24-Pin
MT4C4001JDJ
MT4C4004JDJ
T4C4001JDJ
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Untitled
Abstract: No abstract text available
Text: MT4C4001 J S 1 MEG X 4 DRAM (MICRON DRAM 1 MEG x 4 DRAM 5V, STANDARD OR SELF REFRESH • 1,024-cycle refresh distributed across 16ms (T4C4001J) or 128ms (T4C4001J S) • Industry-standard pinout, timing, functions and packages • High-perform ance CM OS silicon-gate process
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MT4C4001
024-cycle
MT4C4001J)
128ms
MT4C4001J
20/26-Pin
001217T
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pin diagram for IC 7476
Abstract: INTERNAL DIAGRAM OF IC 7476
Text: ADVANCE |U|ICRON 1 MEG 1 MEG DRAM MODULE MT16D T 164 64 DRAM MODULE 64 DRAM FAST PAGE MODE (MT16D(T)164) LOW POWER, EXTENDED REFRESH (MT16D(T)164 L) FEATURES PIN A SSIG N M E N T (Top View) • Industry-standard pinout in a 168-pin, dual read-out, single in-line package
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MT16D
168-pin,
600mW
024-cycle
128ms
168-Pi
pin diagram for IC 7476
INTERNAL DIAGRAM OF IC 7476
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marking wml
Abstract: j-l003 marking WMM C1994 MT4C4001 MT4C4001J MT4C4001JDJ-6
Text: M ir n O M I .“ hT M T 4C 4001J S 1 M EG X 4 D R A M 1 MEG DRAM X 4 DRAM STANDARD OR SELF REFRESH a J3 > FEATURES • 1,024-cycle refresh distributed across 16ms (T4C4001J) or 128ms (T4C4001J S) • Industry-standard pinout, timing, functions and packages
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MT4C4001
024-cycle
MT4C4001J)
128ms
MT4C4001J
225mW
CI994.
marking wml
j-l003
marking WMM
C1994
MT4C4001JDJ-6
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DM-01
Abstract: Techno RC
Text: MT2D18 1 MEG x 8 DRAM MODULE I^ IC R O N REFRESH _ Returning RAS and CAS HIGH terminates a m emory cycle and decreases chip current to a reduced standby level. A lso, the chip is preconditioned for the next cycle during the RAS HIGH time. M emory cell data is retained in its
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MT2D18
T4C4001JDJ
MT2Q18
DM-01
Techno RC
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Untitled
Abstract: No abstract text available
Text: MICRON M TECHNOLOGY INC SSE D b lllS M R 0QQ433Q MT4C4004J 1 MEG X 4 DRAM IC R O N DRAM 1 MEG x 4 DRAM _ • Four independent CAS controls, allowing individual manipulation to each of the four data Input/Output ports DQ1 through DQ4 . • Offers a single chip solution to byte level parity for 36bit words when using 1 Meg x 4 DRAMs for memory
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0QQ433Q
MT4C4004J
36bit
225mW
024-cycle
00Q4343
T4C4001JDJ
T4C4004JDJ
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T4C4001
Abstract: No abstract text available
Text: M T4C 4001J 1 MEG X 4 DRAM [MICRON 1 MEG x 4 DRAM FAST PAGE MODE FEATURES PIN ASSIGNMENT Top View • Ind u stry stan d ard x4 p in o u t, tim in g , fu n ctio n s and p ackages • H ig h -p erfo rm an ce, C M O S silico n -g a te p ro cess • Sin g le + 5 V ± 1 0 % p o w er sup p ly
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4001J
024-cy
20-Pin
MT4C4001J
T4C4001
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RRH cl2
Abstract: BBU RRH
Text: MT4C4001 J L 1 MEG X 4 DRAM I^IICRDN DRAM 1 MEG x 4 DRAM DRAM STANDARD OR LOW POWER, EXTENDED REFRESH FEATURES • 1,024-cycle refresh distributed across 16ms (T4C4001J) or 128ms (T4C4001J L) • Industry-standard x4 pinout, timing, functions and packages
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MT4C4001
024-cycle
MT4C4001J)
128ms
MT4C4001J
20-Pin
RRH cl2
BBU RRH
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