TSOP IR Search Results

2fu smd transistor

Abstract: Infrared sensor TSOP 1738 diode ESM 765 tsop Ir sensor smd 1608 TSOP44 Package layout TSOP infrared infrared sensor (TSOP 1738)data sheet Compact High-Current and Low VF Surface Mounting Device SBD TC58V16BFT
Contextual Info: Memory MOS Memory Lineup • Static RAM Capacity bits Device TC55V1001ASTI/ASRI 1M Organization Access time (ns) Power supply voltage (V) 128 K X 8 TC55V2001STI/SRI Package Pins TSOP(8 X 13.4) 32 TSOP- (10 X 14) 40 TSOP- (0.4 inch) 44 256 K X 8 TC55V020FT/TR

Contextual Info: TSOP Series Ultra Precision Molded Resistor Networks HOW TO ORDER TSOP 08 A 1003 B C TCR PPM/°°C R = +5 S = +10 E = +25 C = +50 Resistance Tolerance A = +0.05% B = +0.10% C = +0.25% Resistance Value 3 sig. fig & 1 multiplier +1% FEATURES TSOP High Precision NiCr Thin Film Resistor

TSOP RECEIVER

Abstract: TSOP IR ir led receiver bs12 "ir receiver" 19326 led Metal holder smd 83 tsop 38 TSOP1236TB1
Contextual Info: General Information Vishay Semiconductors General Information PRODUCT DESIGNATION AND SELECTION FOR TSOP IR RECEIVER MODULES Description of the TSOP series field codes: T S O P 1 Z Ammo pack optional : Vishay IR receiver Product groups: (blank), 3, 5, 7, 8, 9

Contextual Info: Qualification Report October 1993, Version 1.0, QTP# 93275 Thin Small Outline Package 32 Lead TSOP Type 1 Dry packing required CYPRESS SEMICONDUCTOR PAGE 2 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION Package Outline, Type, or Name: Lead Frame material: 32 Pins TSOP

Contextual Info: n AMENDMENT Advanced Micro Devices CMOS Memory Products 1991 Data Book Handbook Publication: Am27C256 PID# 08007F/1 Page 2-40 Amend this data sheet to add information on the TSOP package that is now available for this product. CONNECTION DIAGRAM TSOP Packages

Contextual Info: 27C512A 512K 64K x 8 CMOS EPROM TSOP 27C512A A complete family of packages is offered to provide the most flexibility in applications. For surface mount applications, PLCC, VSOP, TSOP or SOIC packaging is available. Tape or reel packaging is also available for

ZA104

Abstract: zu107 p028
Contextual Info: SONY CXK58257CTM/CYM/CM/CP -70LLX 32768-word x 8-bit High Speed CMOS Static RAM Description CXK58257CTM CXK58257CYM 28 pin TSOP Plastic 28 pin TSOP (Plastic) CXK58257CM CXK58257CP 28 pin SOP (Plastic) 28 pin DIP (Plastic) The CXK58257CTM/CYM/CM/CP is 262,144 bits

SLUFM1GU

Abstract: hirose 6 pin serial 9 pin serial flash memory 16gb format block diagram laptop ac adapter SLUFM4GU2TUI SLUFM16GU2TU-A usb flash
Contextual Info: 1GB to 16GB USB Flash Module SLUFMxxxU2TU I -y USB Solid-State Flash Disk Capacity: 1GB - 16GB USB 2.0 Compliant Form Factors: • Horizontal Mount • Standard 2x5 or Hirose 9-Pin Connector  2x Planar TSOP Flash or 2x Stacked TSOP Flash High Reliability:

NTGS3455T1

Contextual Info: NTGS3455T1 Product Preview MOSFET -3.5 Amps, -30 Volts P–Channel TSOP–6 Features http://onsemi.com • Ultra Low RDS on • Higher Efficiency Extending Battery Life • Miniature TSOP–6 Surface Mount Package –3.5 AMPERES –30 VOLTS 100 mW @ VGS = –10 V

NTGS3433T1

Contextual Info: NTGS3433T1 Product Preview MOSFET -3.3 Amps, -12 Volts P–Channel TSOP–6 Features http://onsemi.com • Ultra Low RDS on • Higher Efficiency Extending Battery Life • Miniature TSOP–6 Surface Mount Package –3.3 AMPERES –12 VOLTS 75 mW @ VGS = –4.5 V

Contextual Info: 1C 235 SERIES tsop •Applicable 1C Dimensions FEATURES • Open top type sockets for TSOP packages. • Unique, compact design ensures high-density mounting of burn-in inboards. • Unique contact design ensures outstanding contact reliability especially in monitored burn-in operations.

IRFTS9342TRPBF

Contextual Info: IRF5801PbF-1 HEXFET Power MOSFET VDS RDS on max (@VGS = 10V) Qg (typical) ID (@TA = 25°C) 200 V 2.20 Ω 3.9 0.6 D 1 6 D nC D 2 5 D A G 3 4 S TSOP-6 Features Industry-standard pinout TSOP-6 Package Compatible with Existing Surface Mount Techniques RoHS Compliant, Halogen-Free

200B

Abstract: 27C512-12 27C512-15 27C512A
Contextual Info: 27C512A 512K 64K x 8 CMOS EPROM PACKAGE TYPES TSOP 27C512A A complete family of packages is offered to provide the most flexibility in applications. For surface mount applications, PLCC, VSOP, TSOP or SOIC packaging is available. Tape or reel packaging is also available for

block diagram laptop ac adapter

Abstract: SLUFM16GU2U-A nand flash pcb layout design serial flash memory 16gb format JESD22-B110 nand flash 16gb hirose 6 pin serial 9 pin
Contextual Info: 1GB to 16GB USB Flash Module www.stec-inc.com SLUFMxGU2U I -y USB Solid-State Flash Disk Capacity: 1GB - 16GB USB 2.0 Compliant Form Factors: • Horizontal Mount • Standard Connector or 9-Pin DConnector  1-High TSOP Flash Placement or Stacked TSOP Flash Placement

Ah 55l

Contextual Info: SONY CXK584000TM/YM/M/P|^C7oll0ioll 524288-word x 8-bit High Speed CMOS Static RAM Description CXK584000TM/YM/M/P is a 4,194,304 bits high speed CMOS static RAM organized as 524288-word CXK584000TM CXK584000YM 32 pin TSOP Plastic 32 pin TSOP (Plastic) CXK584000M

A12E

Abstract: LH2B 48-PIN FBGA048-P-0808 LH28F800SGH-L LH28F800SG-L TSOP048-P-1220
Contextual Info: SHARP LH28F800SG-L/SGH-L FOR TSOP, CSP LH28F800SG-L/SGH-L (FOR TSOP, CSP) Flash Memories DESCRIPTION • Enhanced automated suspend options The LH 28F800S G -L/SG H -L flash m em ories with SmartVoltage technology are high-density, low-cost, - Word write suspend to read

HYMD564M646C

Abstract: d431 DDR266 DDR266B DDR333 DDR400 DDR400B HYMD532M646C hynix ddr hynix ddr sdram
Contextual Info: 200pin DDR SDRAM SO-DIMMs based on 512Mb C ver. TSOP This Hynix unbuffered Small Outline, Dual In-Line Memory Module (DIMM) series consists of 512Mb C ver. DDR SDRAMs in 400mil TSOP II packages on a 200pin glass-epoxy substrate. This Hynix 512Mb C ver. based unbuffered

P0820A

Contextual Info: SONY CXK581000ATM/AYM/AM/AP -55SL/70SL/1OSL 131072-word x 8-bit High Speed CMOS Static RAM Description The CXK581000ATM/AYM/AM/AP is a high speed CMOS static RAM organized as 131072-words by CXK581000ATM CXK581000AYM 32 pin TSOP Plastic 32 pin TSOP (Plastic)

Contextual Info: SO NY CXK581OOOATM/AYM/AM/AP -70LLX/10LLX 131,072-word x 8-bit High-Speed CMOS Static RAM Description The CXK581 OOOATM/AYM/AM/AP are high speed CMOS static RAMs organized as 131,072-words-by-8bits. CXK581000ATM CXK581OOOAYM 32-pin TSOP Plastic 32-pin TSOP (Plastic)

TSOP 48 pin flash gbit

Abstract: JS28F00AP33BF 1FFC000
Contextual Info: Numonyx Axcell P33-65nm Flash Memory 512-Mbit , 1-Gbit , 2-Gbit Datasheet Product Features  High performance:  TSOP: — 105ns initial access time 512-Mbit, 1-Gbit Easy BGA and TSOP: — Buffered Enhanced Factory Programming at 2.0MByte/s (typ) using 512-word buffer

Contextual Info: Gold Termination TSOP Series Ultra Precision Molded Resistor Networks HOW TO ORDER TSOP G 08 A 1003 B C TCR PPM/°°C R = +5 S = +10 E = +25 C = +50 Resistance Tolerance A = +0.05% B = +0.10% C = +0.25% Resistance Value 3 sig. fig & 1 multiplier +1% FEATURES

Contextual Info: 200pin DDR SDRAM SO-DIMMs based on 512Mb C ver. TSOP This Hynix unbuffered Small Outline, Dual In-Line Memory Module (DIMM) series consists of 512Mb C ver. DDR SDRAMs in 400mil TSOP II packages on a 200pin glass-epoxy substrate. This Hynix 512Mb C ver. based unbuffered

Contextual Info: 200pin DDR SDRAM SO-DIMMs based on 512Mb C ver. TSOP This Hynix unbuffered Small Outline, Dual In-Line Memory Module (DIMM) series consists of 512Mb C ver. DDR SDRAMs in 400mil TSOP II packages on a 200pin glass-epoxy substrate. This Hynix 512Mb C ver. based unbuffered

Contextual Info: 200pin DDR SDRAM SO-DIMMs based on 512Mb C ver. TSOP This Hynix unbuffered Small Outline, Dual In-Line Memory Module (DIMM) series consists of 512Mb C ver. DDR SDRAMs in 400mil TSOP II packages on a 200pin glass-epoxy substrate. This Hynix 512Mb C ver. based unbuffered