WIRE BOND PULL Search Results

precap

Contextual Info: Manufacturing Flow KIT FORMATION KIT INSPECTION DIE & COMPONENT ATTACH - WITH EPOXY CURE EPOXY CUSTOMER SOURCE INSPECTION IF APPLICABLE VACUUM BAKE HERMETIC SEAL MARK WIRE BOND QUAL/DESTRUCT WIRE PULL TEMPERATURE CYCLE WIRE BOND CONSTANT ACCELERATION WIRE BOND

XC2V1000

Abstract: XC2V1000 Pin-out IO-L93N XC2V80 XC2V40 XC2V250 XC2V500
Contextual Info: R Pinout Information Introduction This section describes the pinouts for Virtex-II devices in the following packages: • • • • • CS144: wire-bond chip-scale ball grid array BGA of 0.80 mm pitch FG256, FG456, and FG676: wire-bond fine-pitch BGA of 1.00 mm pitch

Quality & Reliability

Contextual Info: Quality & Reliability Program Calogic Quality Flow for Semiconductor Circuit Manufacturing Receiving Assembly QC Operator Monitor and Process Audit Die attach Lead-bond inspect Wire pull-test Incoming Inspection 100% Production 3rd Optical Stores QC Gate 3rd Optical

nsmd smd

Abstract: AND8195 SO8FL Solder paste stencil life AND8195/D 020C 1505C
Contextual Info: AND8195/D Board Mounting Notes for SO8−Flat Lead Prepared by: Steve St. Germain, Phil Celaya, and Isauro Amaro ON Semiconductor http://onsemi.com APPLICATION NOTE INTRODUCTION Wire Bond Various ON Semiconductor devices are packaged in an advanced power leadless package named Quad Flat

SO8FL

Abstract: FOOTPRINT PCB nsmd smd stencil tension WS3060 so8 pcb pattern 1505C 020C
Contextual Info: AND8195/D Board Mounting Notes for SO8−Flat Lead Prepared by: Steve St. Germain, Phil Celaya, and Isauro Amaro ON Semiconductor http://onsemi.com APPLICATION NOTE INTRODUCTION Wire Bond Various ON Semiconductor devices are packaged in an advanced power leadless package named Quad Flat

LDMOS

Contextual Info: POLYFET RF DEVICES LDMOS Lateral Double Diffuse MOS Transistor The Next Generation polyfet rf devices 1 DMOS Technology • Vertical DMOS 9 Lateral DMOS • Bottom Side Drain • Source bond wire reducing gain • Higher Crss • BEO isolation • High Package Cost

ABLEBONd 84-1

Abstract: JESD22-B116 Ablebond 84-1 LMISR4 JESD22-A101 LMISR4 A101 G600 JESD22 9110l
Contextual Info: THYRISTOR SURGE PROTECTORS Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team May 6, 2009 PCN Tracking Number 48 Change from Gold to Copper Wire In 2Q08, Bourns qualified a change to the base metal composition of the wires used to bond overvoltage protection chips to the package terminals of the 8-pin SOP 150 mil package.

ABLEBONd 84-1

Abstract: Ablebond 84-1 LMISR4 JESD22-B116 G600 TISP61089HDMR-S MIL-STD-883-2019 A101 B116 JESD22 TISP9110LDMR-S
Contextual Info: THYRISTOR SURGE PROTECTORS Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team May 6, 2009 PCN Tracking Number 48 Change from Gold to Copper Wire In 2Q08, Bourns qualified a change to the base metal composition of the wires used to bond overvoltage protection chips to the package terminals of the 8-pin SOP 150 mil package.

Excelics Semiconductor

Abstract: wrist
Contextual Info: Excelics Semiconductor, Inc. DISTRIBUTION: CEO Marketing & Sales Human Resources Engineering Services Approvals Design & Test Engineering Fabrication Assembly & Test Purchasing Quality Assurance Document Control Shipping & Receiving ALL REV DESCRIPTION 01

Die Attach epoxy stamping

Abstract: national semiconductor handbook national application handbook wire bond LM117 goodrich resin ltcc chip copper bond wire DIE ATTACH National Semiconductor Top Mark
Contextual Info: Considerations in Implementing Chip-on-Board and Multi-Die Assemblies Mark McClintick Process Engineer September 17, 2003 Agenda • Manufacturing flow overview • Process considerations • General layout approaches • Thermal considerations 2 2003 National Semiconductor Corporation

SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY

Abstract: MS011800 bond wire gold copper bond wire cte table epoxy substrate soft solder wire dispensing NATIONAL SEMICONDUCTOR ink MARKING AU4A cte table ic bga PCB monitor spc
Contextual Info: Semiconductor Packaging Assembly Technology Introduction This chapter describes the fundamentals of the processes used by National Semiconductor to assemble IC devices in electronic packages. Electronic packaging provides the interconnection from the IC to the printed circuit board PCB .

MASK ROM 32M PROGRAM

Abstract: samsung led monitor TTL 154 PAD 11
Contextual Info: K3N6V U 1000F-C MASK ROM DIE 32M-Bit(4Mx8/2Mx16) CMOS Mask ROM FEATURES •Single 3.3V/ Single 3.0V power supply •Fast Access Time 3.3V Operation : 100ns (min)@CL=50pF 3.0V Operation : 120ns (min)@CL=100pF •x16 or x8 configurable with BHE-pin •TTL compatible inputs and outputs

Silicon Controlled Rectifier Manual

Abstract: jedec tray bare die JESD 49 JESD-49 AN-1060 Three bond soft solder die bonder AN1060
Contextual Info: Application Note AN-1060 Bare Die: Handling and Storage By Richard Clark Table of Contents Page Introduction .1 Packing/Carrier Type .1

samsung led monitor

Contextual Info: K3N6C1000F-C MASK ROM DIE 32M-Bit 4Mx8/2Mx16 CMOS Mask ROM FEATURES •Single 5.0V power supply •Fast Access Time 5.0V Operation : 100ns (min)@CL=50pF 120ns (min)@CL=100pF •x16 or x8 configurable with BHE-pin •TTL compatible inputs and outputs •Three State Outputs

ultrasonic bond

Abstract: schematic WELDER Gunn Diode schematic WELDER capacitor M541 varactor beam lead thermal conductive teflon mesa similar
Contextual Info: Application Note M an A M P com pany Bonding and Handling Procedures for Chip Diode Devices M541 V 2.00 Discussion Microstrip Packages and Chip Carriers Chip diode devices for use in integrated circuit and hybrid integrated circuits have proliferated in the last

AN-1060

Abstract: Silicon Controlled Rectifier Manual an1060 ultrasonic bond Three bond jedec tray bare die JESD 49
Contextual Info: AN-1060 International Rectifier • 233 Kansas Street, El Segundo, CA 90245 ! USA BARE DIE: HANDLING AND STORAGE By Richard Clark Introduction International Rectifier supply a range of power devices in a variety of packages and in Bare Die form. The Bare Die products are available in a

Contextual Info: 3 Shield Bonding Products Scotchlok 4460 Shield Bond Connector No Tabbing Required Scotchlok 4460-S Shield Bond Connector The 4460-S Shield Bond Connector is designed to make a stable, low-resistance electrical connection between the shield of a communications cable and a

AN-1061

Abstract: Ultrasonic welding circuit centrifuge machine for acceleration epoxy adhesive paste cte table soft solder die bonding ultrasonic flow meter ultrasonic transducer circuit ultrasonic generator ultrasonic bond Ultrasonic Transducer for gas meter
Contextual Info: Application Note AN-1061 Bare Die: Die Attach and Wire Bonding Guidance for setting up assembly processes By Richard Clark Table of Contents Page Introduction .1 Storage and Handling .2

MSTF-2ST-10R00J-G

Abstract: Au Sn eutectic M570 bond wire gold soft solder die bonding 84-1LMI
Contextual Info: Bonding, Handling, and Mounting Procedures for Millimeterwave PHEMT MMIC’s Discussion Millimeterwave MMIC's are becoming more common in commercial applications. Their small size and potentially lower cost has made them valuable in the growing market of millimeterwave systems. Their size and delicate nature

Sn60A

Abstract: MIL-STD-883H MIL-STD-883H 2004.6 sodium silicate QQ-S-571 QQ-S-571, Class Sn 50 ultrasonic motion detector J-STD-002 MIL-F-14256 20 PIN LEADLESS CHIP CARRIER THICK FILM
Contextual Info: MIL-STD-883H METHOD 2001.3 * CONSTANT ACCELERATION 1. PURPOSE. This test is used to determine the effects of constant acceleration on microelectronic devices. It is an accelerated test designed to indicate types of structural and mechanical weaknesses not necessarily detected in shock and

9lprs

Abstract: 9lprs477 9lprs387 9lprs365 9LRS3165 9lprs325 9LPRS355 9LPR 9lprs914 9LPRS918
Contextual Info: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road San Jose, CA 96138 PCN #: A0903-04 Product Affected: PRODUCT/PROCESS CHANGE NOTICE PCN DATE: May 8, 2009 MEANS OF DISTINGUISHING CHANGED DEVICES: 9 mm x 9 mm VFQFPN-64 Product Mark 10 mm x 10 mm VFQFPN-72

NATIONAL SEMICONDUCTOR ink MARKING

Abstract: Die Attach epoxy stamping cte table flip chip substrate cte table ic bga JESD 49 gold wire bond failures due to ultrasonic cleaning Aluminum alloys physical properties FLIP CHIP PRODUCTS micro machine thermal conductivity coefficient of thermal expansion of thermal conductive pressure sensitive adhesive
Contextual Info: September 2000 Die Products Business Unit as watches, calculators and smart cards as well as leading edge multiple die applications like cellular handsets and digital cameras. Better device performance utilizing die show up in processor modules for computers, workstations and servers as

9LRS3199AKLFT

Abstract: 9LvS3199aklft 9LRS3199 JESD22-B116 9lprs 9LRS3197 9LRS4116 vfqfpn-32 9LRS 9LvS3199
Contextual Info: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road San Jose, CA 96138 PCN #: A0910-01 Product Affected: PRODUCT/PROCESS CHANGE NOTICE PCN DATE: November 6, 2009 MEANS OF DISTINGUISHING CHANGED DEVICES: VFQFPN-20, 32, 40, 48, 56 Product Mark

ultrasonic probe ge

Abstract: GaAs MMIC ESD, Die Attach and Bonding Guidelines GaAs FET chip ultrasonic bond AN-1001 Ultrasonic bubble kulicke Soffa nec microwave
Contextual Info: California Eastern Laboratories AN-1001 APPLICATION NOTE RECOMMENDED HANDLING PROCEDURES FOR MICROWAVE TRANSISTOR AND MMIC CHIPS INTRODUCTION This document is provided to inform users of some of the handling precautions necessary and the assembly processes