OQ10 Search Results

cq837

Contextual Info: 4J« *- »t TOSHIBA HYBRID D IG ITA L INTcGRATED CIRCUIT INTEGRATED CIRCUIT TO SHIBA THM 364080AS THM 364080ASG TECHNICAL DATA - 60. 70. 80, 10 - 60, 70, 80. 10 TENTATIVE DATA 4*194,304 W O R D S X 36 BIT D YN AM IC RA M MODULE DESCRIPTION The THM364080AS/ASG is a 4,194,304 words by 36 bits dynamic RA M module which assembled 36

s - ck5t

Abstract: CA52
Contextual Info: Preliminary KMM5321200BW/BWG DRAM MODULE KMM5321200BW/BWG Fast Page Mode 1Mx32 DRAM SIM M , 1K Refresh, 5V, using 1Mx16 DRAM GENERAL DESCRIPTION FEATURES The Samsung KMM5321200BW is a 1M bit x 32 Dynam ic RAM high density m em ory module. The • Part Identification

MSM5416263

Abstract: 256x16* STATIC RAM weland SM5416
Contextual Info: OKI Semiconductor MSM5416263 262,144-W ord x 1 6 -Bit M ultiport D RA M DESCRIPTION The MSM5416263 is a 4-Mbit CMOS multiport DRAM composed of a 262,144-word by 16-bit dynamic RAM and a 512-word by 16-bit SAM. Its RAM and SAM operate independently and asynchronously.

G530T

Contextual Info: •HYUNDAI H Y 6 7 1 6 1 1 0 / 1 Ì 1 64K X 16 Bit SYNCHRONOUS CMOS SRAM PRELIMINARY DESCRIPTION This device integrates high-speed 64Kx16 SRAM core, address registers, data input registers, a 2-bit burst address counter and Non-pipelined output. All synchronous inputs pass through registers controlled by a

Contextual Info: n u N EW PRODUCT HB56G51236CC Series 524,288-WordX 36-Bit High Density Dynamic RAM Card 0H IT A C H 1 Rev.2 Ju n . 30,1992 Description The HB56G51236CC is a 512KX36 dynam ic RA M Card, mounted 4 pieces of 4M bit D RA M HM 514900LTT sealed in T S O P package.

Contextual Info: PRELIMINARY MICRON » j! MT24D836 8 MEG X 36, 16 MEG x 18 DRAM MODULE 8 MEG x 36,16 MEG x18 DRAM MODULE FAST PAGE MODE FEATURES • Industry-standard pinout in a 72-pin single-in-line package • High-perform ance CMOS silicon-gate process • Single 5V ±10% pow er supply

dq35j

Abstract: Nippon capacitors
Contextual Info: MM2M0J32L / MM2M0J36L CMOS 2M x 32bit / 36bit Fast Page Mode Memory Module DESCRIPTION The MM1M0J32L/J36L is a 64 Megabit Dynamic Random Access Memory Module organized as 2,097,152 x 32 x 36 bits in a 72 lead single inline module. The module contains sixteen 1M x 4bit Dynamic Random Access

v9511

Abstract: T1464
Contextual Info: PRELIMINARY 4 MEG x 64 DRAM MODULE 32 MEGABYTE, 3.3V, OPTIONAL SELF REFRESH, FAST PAGE OR EDO PAGE MODE FEATURES • JEDEC- and industry-standard nout in a 168-pin, dual-in-line memory m odule E IVIM) • High-performance CMOS silico i -gate process • Single +3.3V ±0.3V power supply• All device pins are TTL-compat ,ble

Contextual Info: HYUNDAI H Y M 5 V 7 2 A 1 2 0 A 1M X X - S e r ie s 72-bit CMOS DRAM MODULE DESCRIPTION The HYM5V72A120A is a 1M x 72-bit Fast page mode CMOS DRAM module consisting of two HY51V4400B in 20/26 pin SOJ or TSOP-II, four HY51V18160B 42/42 pin SOJ or 44/50 pin TSOP-li and two 16-bit BiCMOS line driver

VV005

Contextual Info: »HYUNDAI HY51V4370B f e r ie s 256KX 16-bit CMOS DRAM with 2 WE & WPB PRELIMINARY DESCRIPTION The HY51V4370B is the new generation and fast dynamic RAM organized 262,144 x 16-bit configuration employing advanced submicron CMOS process technology and advanced circuit design technique to achieve

Contextual Info: MITSUBISHI LS Is DRAM MODULE MH4M325CXJ-5,-6,-7/ MH4M325CNXJ-5,-6,-7 HYPER PAGE MODE 134217728-BIT (4194304-WQRD BY 32-BIT) DYNAMIC RAM DESCRIPTION The MH4M325CXJ/CNXJ is 4194304-word x 32-bit dynamic RAM. This consists of eight industry standard 4M x 4

MT4C4007JDJ

Abstract: ST bsx 26
Contextual Info: MTHat3Z XI(SFr MTt6D222(XJ (S | t M B G *ZM EE jc3ZDRÄIW1 M O D ULE DRAM 1 MEG, 2 MEG x 32 M UW D U L tr - 4, 8 MEGABYTE, 5V, OPTIONAL SELF REFRESH, FAST PAGE OR EDO PAGE MOPE FEATURES • JE D E C - a n d i n d u s tr y - s ta n d a r d pinout in a 72-pin,

Contextual Info: ADVANCE jp il r p n M MT9LD272 B N , MT18LD472 B(N) 2, 4 MEG X 72 BURST EDO DRAM MODULES BURST EDO IDRAM MODULE 2, 4 MEG x 72 16,32 MEGABYTE, 3.3V,ECC, BURST EDO FEATURES • • • • • • • • • 168-pin, d ual-in-line m em ory m odule (D IM M )

DUP1

Contextual Info: FIJCRON TECHNOLOGY INC MICRON SSE T> • blllSMT DD037M3 DT4 ■ URN M T56C 2818 8 K x 18, DUAL 4 K x 18 C A CH E DATA SRAM ■ - ; CACHE DATA -0 4 - q q a i i

ea423

Contextual Info: N E C E LECTRONI CS INC blE ì> m b427525 NEC 0D34317 MC-422000A 32 2,097,152 X 32-Bit Dynamic CMOS RAM Module NEC Electronics Inc. Description Pin Configuration The MC-422000A32 is a fast-page dynamic RAM mod­ ule organized as 2,097,152 words by 32 bits and de­

Contextual Info: MICRON • 64K TECHNOLOGY, MC. MT58LC64K32/36B3 32/36 SYNCBURST SRAM X 64K x 32/36 SRAM SYNCHRONOUS SRAM +3.3V SUPPLY, FLOW-THROUGH AND SELECTABLE BURST MODE FEATURES • • • • • • • Fast access times: 8.5,9, lOand 11ns Fast OE# access time: 5ns

Contextual Info: “HYUNDAI U HYM5V36223A X-S ries 2M x 36-bit CMOS DRAM MODULE DESCRIPTION The HYM5V36223A is a 2M x 36-bit Fast page mode CMOS DRAM module consisting of four HY51V18160B in 42/42 pin SOJ or 42/50 pin TSOPII and two HY51V4403B in 24/26 pin SOJ or TSOPII on a 72 pin glass-epoxy

8192k

Abstract: fr 4 substrate
Contextual Info: ^EDI EDI8F16512C ELECTRONIC OESIGNS INC. « Commercial Eight Megabit SRAM Module 512Kx16 Static RAM CMOS, Module Features The EDI8F16512C is a 8192K bit CMOS Static RAM based on eight 128Kx8 Static RAMs mounted on a multi­ layered epoxy laminate FR-4 substrate.

Contextual Info: DENSE-PAC 1152 Megabit CMOS DRAM MICROSYSTEMS DP3D16MS72PKW5 ADVANCED INFORMATION D ESCRIPTIO N : The DP3D16MS72PKW5 is the 16 Meg x 72 Dynamic RAM module in the family of Super DIMM modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of twentyfour dynamic RAM stacks

Contextual Info: May 1990 FUJITSU PRODUCT PROFILE MB85414-30/-40 CMOS STATIC RAM MODULE 16384 Words x 32-Bit The Fujitsu MB85414 is a fully decoded, CMOS static random access memory module SRAM with eight MB81C75 devices mounted on a 64-pin Epoxy module. These modules incorporate a presence detect feature that

Contextual Info: MITSUBISHI LS Is DRAM MODULE M H 1 6 M 4 0 A J -6 ,-7 / M H 1 6 M 4 0 N A J -6 ,-7 FAST PAGE MODE 671088640-BIT (16777216-WORD BY 40-BIT) DYNAMIC RAM DESCRIPTION The M H16M 40AJ/NAJ is 16777216-word x 40-bit dynamic PIN CONFIGURATION (TOP VIEW) [Both side]

CDQ15

Abstract: COOA EDH816H64C 1024K-BIT
Contextual Info: ELECTRONIC D E S I GN S INC 30E D • 32301m ■ EDI 0dQat.3b 1 ■ ED H 8 1 6 H 6 4 C E t*d ic n le D tilg ra I n c . High Speed Megabit SRAM Module 64Kx16 CMOS, High Speed Programmable, Static RAM Module Features The EDH816H64C Isa 1024K-bit high speed CMOS

HYM564220XG

Contextual Info: HYM564220 X-Series HYUNDAI 2M x 64-bit CMOS DRAM MODULE DESCRIPTION The HYM564220 is a 2M x 64-bit Fast page mode CMOS DRAM module consisting ol eight HY5118160 in 42/42 pin SOJ and two 16-bit BiCMOS line driver in TSSOP on a 168 pin glass-epoxy printed circuit board. 0.22|aF

1AD1S

Contextual Info: "HYUNDAI H Y 5 1 1 8 2 6 0 J ïe r ie s 1 M x 1 6 - b it C M O S D R A M w it h 2 C A S &W PB DESCRIPTION The HY5118260 is the new generation and fast dynamic RAM organized 1,048,576 x 16-bit. The HY5118260 utilizes Hyundai's CMOS silicon gate process technology as well as advanced circuit techniques to provide wide